1# 2# Generic thermal sysfs drivers configuration 3# 4 5menuconfig THERMAL 6 tristate "Generic Thermal sysfs driver" 7 help 8 Generic Thermal Sysfs driver offers a generic mechanism for 9 thermal management. Usually it's made up of one or more thermal 10 zone and cooling device. 11 Each thermal zone contains its own temperature, trip points, 12 cooling devices. 13 All platforms with ACPI thermal support can use this driver. 14 If you want this support, you should say Y or M here. 15 16if THERMAL 17 18config THERMAL_HWMON 19 bool 20 prompt "Expose thermal sensors as hwmon device" 21 depends on HWMON=y || HWMON=THERMAL 22 default y 23 help 24 In case a sensor is registered with the thermal 25 framework, this option will also register it 26 as a hwmon. The sensor will then have the common 27 hwmon sysfs interface. 28 29 Say 'Y' here if you want all thermal sensors to 30 have hwmon sysfs interface too. 31 32config THERMAL_OF 33 bool 34 prompt "APIs to parse thermal data out of device tree" 35 depends on OF 36 default y 37 help 38 This options provides helpers to add the support to 39 read and parse thermal data definitions out of the 40 device tree blob. 41 42 Say 'Y' here if you need to build thermal infrastructure 43 based on device tree. 44 45config THERMAL_WRITABLE_TRIPS 46 bool "Enable writable trip points" 47 help 48 This option allows the system integrator to choose whether 49 trip temperatures can be changed from userspace. The 50 writable trips need to be specified when setting up the 51 thermal zone but the choice here takes precedence. 52 53 Say 'Y' here if you would like to allow userspace tools to 54 change trip temperatures. 55 56choice 57 prompt "Default Thermal governor" 58 default THERMAL_DEFAULT_GOV_STEP_WISE 59 help 60 This option sets which thermal governor shall be loaded at 61 startup. If in doubt, select 'step_wise'. 62 63config THERMAL_DEFAULT_GOV_STEP_WISE 64 bool "step_wise" 65 select THERMAL_GOV_STEP_WISE 66 help 67 Use the step_wise governor as default. This throttles the 68 devices one step at a time. 69 70config THERMAL_DEFAULT_GOV_FAIR_SHARE 71 bool "fair_share" 72 select THERMAL_GOV_FAIR_SHARE 73 help 74 Use the fair_share governor as default. This throttles the 75 devices based on their 'contribution' to a zone. The 76 contribution should be provided through platform data. 77 78config THERMAL_DEFAULT_GOV_USER_SPACE 79 bool "user_space" 80 select THERMAL_GOV_USER_SPACE 81 help 82 Select this if you want to let the user space manage the 83 platform thermals. 84 85config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 86 bool "power_allocator" 87 select THERMAL_GOV_POWER_ALLOCATOR 88 help 89 Select this if you want to control temperature based on 90 system and device power allocation. This governor can only 91 operate on cooling devices that implement the power API. 92 93endchoice 94 95config THERMAL_GOV_FAIR_SHARE 96 bool "Fair-share thermal governor" 97 help 98 Enable this to manage platform thermals using fair-share governor. 99 100config THERMAL_GOV_STEP_WISE 101 bool "Step_wise thermal governor" 102 help 103 Enable this to manage platform thermals using a simple linear 104 governor. 105 106config THERMAL_GOV_BANG_BANG 107 bool "Bang Bang thermal governor" 108 default n 109 help 110 Enable this to manage platform thermals using bang bang governor. 111 112 Say 'Y' here if you want to use two point temperature regulation 113 used for fans without throttling. Some fan drivers depend on this 114 governor to be enabled (e.g. acerhdf). 115 116config THERMAL_GOV_USER_SPACE 117 bool "User_space thermal governor" 118 help 119 Enable this to let the user space manage the platform thermals. 120 121config THERMAL_GOV_POWER_ALLOCATOR 122 bool "Power allocator thermal governor" 123 help 124 Enable this to manage platform thermals by dynamically 125 allocating and limiting power to devices. 126 127config CPU_THERMAL 128 bool "generic cpu cooling support" 129 depends on CPU_FREQ 130 depends on THERMAL_OF 131 help 132 This implements the generic cpu cooling mechanism through frequency 133 reduction. An ACPI version of this already exists 134 (drivers/acpi/processor_thermal.c). 135 This will be useful for platforms using the generic thermal interface 136 and not the ACPI interface. 137 138 If you want this support, you should say Y here. 139 140config CLOCK_THERMAL 141 bool "Generic clock cooling support" 142 depends on COMMON_CLK 143 depends on PM_OPP 144 help 145 This entry implements the generic clock cooling mechanism through 146 frequency clipping. Typically used to cool off co-processors. The 147 device that is configured to use this cooling mechanism will be 148 controlled to reduce clock frequency whenever temperature is high. 149 150config DEVFREQ_THERMAL 151 bool "Generic device cooling support" 152 depends on PM_DEVFREQ 153 depends on PM_OPP 154 help 155 This implements the generic devfreq cooling mechanism through 156 frequency reduction for devices using devfreq. 157 158 This will throttle the device by limiting the maximum allowed DVFS 159 frequency corresponding to the cooling level. 160 161 In order to use the power extensions of the cooling device, 162 devfreq should use the simple_ondemand governor. 163 164 If you want this support, you should say Y here. 165 166config THERMAL_EMULATION 167 bool "Thermal emulation mode support" 168 help 169 Enable this option to make a emul_temp sysfs node in thermal zone 170 directory to support temperature emulation. With emulation sysfs node, 171 user can manually input temperature and test the different trip 172 threshold behaviour for simulation purpose. 173 174 WARNING: Be careful while enabling this option on production systems, 175 because userland can easily disable the thermal policy by simply 176 flooding this sysfs node with low temperature values. 177 178config HISI_THERMAL 179 tristate "Hisilicon thermal driver" 180 depends on ARCH_HISI || COMPILE_TEST 181 depends on HAS_IOMEM 182 depends on OF 183 default y 184 help 185 Enable this to plug hisilicon's thermal sensor driver into the Linux 186 thermal framework. cpufreq is used as the cooling device to throttle 187 CPUs when the passive trip is crossed. 188 189config IMX_THERMAL 190 tristate "Temperature sensor driver for Freescale i.MX SoCs" 191 depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST 192 depends on MFD_SYSCON 193 depends on OF 194 help 195 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 196 It supports one critical trip point and one passive trip point. The 197 cpufreq is used as the cooling device to throttle CPUs when the 198 passive trip is crossed. 199 200config MAX77620_THERMAL 201 tristate "Temperature sensor driver for Maxim MAX77620 PMIC" 202 depends on MFD_MAX77620 203 depends on OF 204 help 205 Support for die junction temperature warning alarm for Maxim 206 Semiconductor PMIC MAX77620 device. Device generates two alarm 207 interrupts when PMIC die temperature cross the threshold of 208 120 degC and 140 degC. 209 210config QORIQ_THERMAL 211 tristate "QorIQ Thermal Monitoring Unit" 212 depends on THERMAL_OF 213 depends on HAS_IOMEM 214 help 215 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms. 216 It supports one critical trip point and one passive trip point. The 217 cpufreq is used as the cooling device to throttle CPUs when the 218 passive trip is crossed. 219 220config SPEAR_THERMAL 221 tristate "SPEAr thermal sensor driver" 222 depends on PLAT_SPEAR || COMPILE_TEST 223 depends on HAS_IOMEM 224 depends on OF 225 help 226 Enable this to plug the SPEAr thermal sensor driver into the Linux 227 thermal framework. 228 229config ROCKCHIP_THERMAL 230 tristate "Rockchip thermal driver" 231 depends on ARCH_ROCKCHIP || COMPILE_TEST 232 depends on RESET_CONTROLLER 233 depends on HAS_IOMEM 234 help 235 Rockchip thermal driver provides support for Temperature sensor 236 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 237 trip point. Cpufreq is used as the cooling device and will throttle 238 CPUs when the Temperature crosses the passive trip point. 239 240config RCAR_THERMAL 241 tristate "Renesas R-Car thermal driver" 242 depends on ARCH_RENESAS || COMPILE_TEST 243 depends on HAS_IOMEM 244 help 245 Enable this to plug the R-Car thermal sensor driver into the Linux 246 thermal framework. 247 248config RCAR_GEN3_THERMAL 249 tristate "Renesas R-Car Gen3 thermal driver" 250 depends on ARCH_RENESAS || COMPILE_TEST 251 depends on HAS_IOMEM 252 depends on OF 253 help 254 Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux 255 thermal framework. 256 257config KIRKWOOD_THERMAL 258 tristate "Temperature sensor on Marvell Kirkwood SoCs" 259 depends on MACH_KIRKWOOD || COMPILE_TEST 260 depends on HAS_IOMEM 261 depends on OF 262 help 263 Support for the Kirkwood thermal sensor driver into the Linux thermal 264 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 265 266config DOVE_THERMAL 267 tristate "Temperature sensor on Marvell Dove SoCs" 268 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 269 depends on HAS_IOMEM 270 depends on OF 271 help 272 Support for the Dove thermal sensor driver in the Linux thermal 273 framework. 274 275config DB8500_THERMAL 276 tristate "DB8500 thermal management" 277 depends on MFD_DB8500_PRCMU 278 default y 279 help 280 Adds DB8500 thermal management implementation according to the thermal 281 management framework. A thermal zone with several trip points will be 282 created. Cooling devices can be bound to the trip points to cool this 283 thermal zone if trip points reached. 284 285config ARMADA_THERMAL 286 tristate "Armada 370/XP thermal management" 287 depends on ARCH_MVEBU || COMPILE_TEST 288 depends on HAS_IOMEM 289 depends on OF 290 help 291 Enable this option if you want to have support for thermal management 292 controller present in Armada 370 and Armada XP SoC. 293 294config INTEL_POWERCLAMP 295 tristate "Intel PowerClamp idle injection driver" 296 depends on THERMAL 297 depends on X86 298 depends on CPU_SUP_INTEL 299 help 300 Enable this to enable Intel PowerClamp idle injection driver. This 301 enforce idle time which results in more package C-state residency. The 302 user interface is exposed via generic thermal framework. 303 304config X86_PKG_TEMP_THERMAL 305 tristate "X86 package temperature thermal driver" 306 depends on X86_THERMAL_VECTOR 307 select THERMAL_GOV_USER_SPACE 308 select THERMAL_WRITABLE_TRIPS 309 default m 310 help 311 Enable this to register CPU digital sensor for package temperature as 312 thermal zone. Each package will have its own thermal zone. There are 313 two trip points which can be set by user to get notifications via thermal 314 notification methods. 315 316config INTEL_SOC_DTS_IOSF_CORE 317 tristate 318 depends on X86 319 select IOSF_MBI 320 help 321 This is becoming a common feature for Intel SoCs to expose the additional 322 digital temperature sensors (DTSs) using side band interface (IOSF). This 323 implements the common set of helper functions to register, get temperature 324 and get/set thresholds on DTSs. 325 326config INTEL_SOC_DTS_THERMAL 327 tristate "Intel SoCs DTS thermal driver" 328 depends on X86 329 select INTEL_SOC_DTS_IOSF_CORE 330 select THERMAL_WRITABLE_TRIPS 331 help 332 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital 333 temperature sensor (DTS). These SoCs have two additional DTSs in 334 addition to DTSs on CPU cores. Each DTS will be registered as a 335 thermal zone. There are two trip points. One of the trip point can 336 be set by user mode programs to get notifications via Linux thermal 337 notification methods.The other trip is a critical trip point, which 338 was set by the driver based on the TJ MAX temperature. 339 340config INTEL_QUARK_DTS_THERMAL 341 tristate "Intel Quark DTS thermal driver" 342 depends on X86_INTEL_QUARK 343 help 344 Enable this to register Intel Quark SoC (e.g. X1000) platform digital 345 temperature sensor (DTS). For X1000 SoC, it has one on-die DTS. 346 The DTS will be registered as a thermal zone. There are two trip points: 347 hot & critical. The critical trip point default value is set by 348 underlying BIOS/Firmware. 349 350menu "ACPI INT340X thermal drivers" 351source drivers/thermal/int340x_thermal/Kconfig 352endmenu 353 354config INTEL_BXT_PMIC_THERMAL 355 tristate "Intel Broxton PMIC thermal driver" 356 depends on X86 && INTEL_SOC_PMIC_BXTWC && REGMAP 357 help 358 Select this driver for Intel Broxton PMIC with ADC channels monitoring 359 system temperature measurements and alerts. 360 This driver is used for monitoring the ADC channels of PMIC and handles 361 the alert trip point interrupts and notifies the thermal framework with 362 the trip point and temperature details of the zone. 363 364config INTEL_PCH_THERMAL 365 tristate "Intel PCH Thermal Reporting Driver" 366 depends on X86 && PCI 367 help 368 Enable this to support thermal reporting on certain intel PCHs. 369 Thermal reporting device will provide temperature reading, 370 programmable trip points and other information. 371 372config MTK_THERMAL 373 tristate "Temperature sensor driver for mediatek SoCs" 374 depends on ARCH_MEDIATEK || COMPILE_TEST 375 depends on HAS_IOMEM 376 depends on NVMEM || NVMEM=n 377 depends on RESET_CONTROLLER 378 default y 379 help 380 Enable this option if you want to have support for thermal management 381 controller present in Mediatek SoCs 382 383menu "Texas Instruments thermal drivers" 384depends on ARCH_HAS_BANDGAP || COMPILE_TEST 385depends on HAS_IOMEM 386source "drivers/thermal/ti-soc-thermal/Kconfig" 387endmenu 388 389menu "Samsung thermal drivers" 390depends on ARCH_EXYNOS || COMPILE_TEST 391source "drivers/thermal/samsung/Kconfig" 392endmenu 393 394menu "STMicroelectronics thermal drivers" 395depends on ARCH_STI && OF 396source "drivers/thermal/st/Kconfig" 397endmenu 398 399config TANGO_THERMAL 400 tristate "Tango thermal management" 401 depends on ARCH_TANGO || COMPILE_TEST 402 help 403 Enable the Tango thermal driver, which supports the primitive 404 temperature sensor embedded in Tango chips since the SMP8758. 405 This sensor only generates a 1-bit signal to indicate whether 406 the die temperature exceeds a programmable threshold. 407 408source "drivers/thermal/tegra/Kconfig" 409 410config QCOM_SPMI_TEMP_ALARM 411 tristate "Qualcomm SPMI PMIC Temperature Alarm" 412 depends on OF && SPMI && IIO 413 select REGMAP_SPMI 414 help 415 This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP) 416 PMIC devices. It shows up in sysfs as a thermal sensor with multiple 417 trip points. The temperature reported by the thermal sensor reflects the 418 real time die temperature if an ADC is present or an estimate of the 419 temperature based upon the over temperature stage value. 420 421config GENERIC_ADC_THERMAL 422 tristate "Generic ADC based thermal sensor" 423 depends on IIO 424 help 425 This enabled a thermal sysfs driver for the temperature sensor 426 which is connected to the General Purpose ADC. The ADC channel 427 is read via IIO framework and the channel information is provided 428 to this driver. This driver reports the temperature by reading ADC 429 channel and converts it to temperature based on lookup table. 430 431menu "Qualcomm thermal drivers" 432depends on (ARCH_QCOM && OF) || COMPILE_TEST 433source "drivers/thermal/qcom/Kconfig" 434endmenu 435 436config ZX2967_THERMAL 437 tristate "Thermal sensors on zx2967 SoC" 438 depends on ARCH_ZX || COMPILE_TEST 439 help 440 Enable the zx2967 thermal sensors driver, which supports 441 the primitive temperature sensor embedded in zx2967 SoCs. 442 This sensor generates the real time die temperature. 443 444endif 445