1# SPDX-License-Identifier: GPL-2.0-only 2# 3# Generic thermal drivers configuration 4# 5 6menuconfig THERMAL 7 bool "Thermal drivers" 8 help 9 Thermal drivers offer a generic mechanism for 10 thermal management. Usually it's made up of one or more thermal 11 zones and cooling devices. 12 Each thermal zone contains its own temperature, trip points, 13 and cooling devices. 14 All platforms with ACPI or Open Firmware thermal support can use 15 this driver. 16 If you want this support, you should say Y here. 17 18if THERMAL 19 20config THERMAL_NETLINK 21 bool "Thermal netlink management" 22 depends on NET 23 help 24 The thermal framework has a netlink interface to do thermal 25 zones discovery, temperature readings and events such as 26 trip point crossed, cooling device update or governor 27 change. It is recommended to enable the feature. 28 29config THERMAL_STATISTICS 30 bool "Thermal state transition statistics" 31 help 32 Export thermal state transition statistics information through sysfs. 33 34 If in doubt, say N. 35 36config THERMAL_DEBUGFS 37 bool "Thermal subsystem debug support" 38 depends on DEBUG_FS 39 help 40 Say Y to allow the thermal subsystem to collect diagnostic 41 information that can be accessed via debugfs. 42 43config THERMAL_CORE_TESTING 44 tristate "Thermal core testing facility" 45 depends on DEBUG_FS 46 help 47 Say Y to add a debugfs-based thermal core testing facility. 48 It allows test thermal zones to be created and populated 49 with trip points in order to exercise the thermal core 50 functionality in a controlled way. 51 52config THERMAL_EMERGENCY_POWEROFF_DELAY_MS 53 int "Emergency poweroff delay in milli-seconds" 54 default 0 55 help 56 Thermal subsystem will issue a graceful shutdown when 57 critical temperatures are reached using orderly_poweroff(). In 58 case of failure of an orderly_poweroff(), the thermal emergency 59 poweroff kicks in after a delay has elapsed and shuts down the system. 60 This config is number of milliseconds to delay before emergency 61 poweroff kicks in. Similarly to the critical trip point, 62 the delay should be carefully profiled so as to give adequate 63 time for orderly_poweroff() to finish on regular execution. 64 If set to 0 emergency poweroff will not be supported. 65 66 In doubt, leave as 0. 67 68config THERMAL_HWMON 69 bool 70 prompt "Expose thermal sensors as hwmon device" 71 depends on HWMON=y || HWMON=THERMAL 72 default y 73 help 74 In case a sensor is registered with the thermal 75 framework, this option will also register it 76 as a hwmon. The sensor will then have the common 77 hwmon sysfs interface. 78 79 Say 'Y' here if you want all thermal sensors to 80 have hwmon sysfs interface too. 81 82config THERMAL_OF 83 bool 84 prompt "APIs to parse thermal data out of device tree" 85 depends on OF 86 default y 87 help 88 This options provides helpers to add the support to 89 read and parse thermal data definitions out of the 90 device tree blob. 91 92 Say 'Y' here if you need to build thermal infrastructure 93 based on device tree. 94 95choice 96 prompt "Default Thermal governor" 97 default THERMAL_DEFAULT_GOV_STEP_WISE 98 help 99 This option sets which thermal governor shall be loaded at 100 startup. If in doubt, select 'step_wise'. 101 102config THERMAL_DEFAULT_GOV_STEP_WISE 103 bool "step_wise" 104 select THERMAL_GOV_STEP_WISE 105 help 106 Use the step_wise governor as default. This throttles the 107 devices one step at a time. 108 109config THERMAL_DEFAULT_GOV_FAIR_SHARE 110 bool "fair_share" 111 select THERMAL_GOV_FAIR_SHARE 112 help 113 Use the fair_share governor as default. This throttles the 114 devices based on their 'contribution' to a zone. The 115 contribution should be provided through platform data. 116 117config THERMAL_DEFAULT_GOV_USER_SPACE 118 bool "user_space" 119 select THERMAL_GOV_USER_SPACE 120 help 121 The Userspace governor allows to get trip point crossed 122 notification from the kernel via uevents. It is recommended 123 to use the netlink interface instead which gives richer 124 information about the thermal framework events. 125 126config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 127 bool "power_allocator" 128 depends on THERMAL_GOV_POWER_ALLOCATOR 129 help 130 Select this if you want to control temperature based on 131 system and device power allocation. This governor can only 132 operate on cooling devices that implement the power API. 133 134config THERMAL_DEFAULT_GOV_BANG_BANG 135 bool "bang_bang" 136 depends on THERMAL_GOV_BANG_BANG 137 help 138 Use the bang_bang governor as default. This throttles the 139 devices one step at the time, taking into account the trip 140 point hysteresis. 141 142endchoice 143 144config THERMAL_GOV_FAIR_SHARE 145 bool "Fair-share thermal governor" 146 help 147 Enable this to manage platform thermals using fair-share governor. 148 149config THERMAL_GOV_STEP_WISE 150 bool "Step_wise thermal governor" 151 help 152 Enable this to manage platform thermals using a simple linear 153 governor. 154 155config THERMAL_GOV_BANG_BANG 156 bool "Bang Bang thermal governor" 157 default n 158 help 159 Enable this to manage platform thermals using bang bang governor. 160 161 Say 'Y' here if you want to use two point temperature regulation 162 used for fans without throttling. Some fan drivers depend on this 163 governor to be enabled (e.g. acerhdf). 164 165config THERMAL_GOV_USER_SPACE 166 bool "User_space thermal governor" 167 help 168 Enable this to let the user space manage the platform thermals. 169 170config THERMAL_GOV_POWER_ALLOCATOR 171 bool "Power allocator thermal governor" 172 depends on ENERGY_MODEL 173 help 174 Enable this to manage platform thermals by dynamically 175 allocating and limiting power to devices. 176 177config CPU_THERMAL 178 bool "Generic cpu cooling support" 179 depends on THERMAL_OF 180 help 181 Enable the CPU cooling features. If the system has no active 182 cooling device available, this option allows to use the CPU 183 as a cooling device. 184 185if CPU_THERMAL 186 187config CPU_FREQ_THERMAL 188 bool "CPU frequency cooling device" 189 depends on CPU_FREQ 190 default y 191 help 192 This implements the generic cpu cooling mechanism through frequency 193 reduction. An ACPI version of this already exists 194 (drivers/acpi/processor_thermal.c). 195 This will be useful for platforms using the generic thermal interface 196 and not the ACPI interface. 197 198config CPU_IDLE_THERMAL 199 bool "CPU idle cooling device" 200 depends on IDLE_INJECT 201 help 202 This implements the CPU cooling mechanism through 203 idle injection. This will throttle the CPU by injecting 204 idle cycle. 205endif 206 207config DEVFREQ_THERMAL 208 bool "Generic device cooling support" 209 depends on PM_DEVFREQ 210 depends on PM_OPP 211 help 212 This implements the generic devfreq cooling mechanism through 213 frequency reduction for devices using devfreq. 214 215 This will throttle the device by limiting the maximum allowed DVFS 216 frequency corresponding to the cooling level. 217 218 In order to use the power extensions of the cooling device, 219 devfreq should use the simple_ondemand governor. 220 221 If you want this support, you should say Y here. 222 223config PCIE_THERMAL 224 bool "PCIe cooling support" 225 depends on PCIEPORTBUS 226 help 227 This implements PCIe cooling mechanism through bandwidth reduction 228 for PCIe devices. 229 230 If you want this support, you should say Y here. 231 232config THERMAL_EMULATION 233 bool "Thermal emulation mode support" 234 help 235 Enable this option to make a emul_temp sysfs node in thermal zone 236 directory to support temperature emulation. With emulation sysfs node, 237 user can manually input temperature and test the different trip 238 threshold behaviour for simulation purpose. 239 240 WARNING: Be careful while enabling this option on production systems, 241 because userland can easily disable the thermal policy by simply 242 flooding this sysfs node with low temperature values. 243 244config THERMAL_MMIO 245 tristate "Generic Thermal MMIO driver" 246 depends on OF 247 depends on HAS_IOMEM 248 help 249 This option enables the generic thermal MMIO driver that will use 250 memory-mapped reads to get the temperature. Any HW/System that 251 allows temperature reading by a single memory-mapped reading, be it 252 register or shared memory, is a potential candidate to work with this 253 driver. 254 255config HISI_THERMAL 256 tristate "Hisilicon thermal driver" 257 depends on ARCH_HISI || COMPILE_TEST 258 depends on HAS_IOMEM 259 depends on OF 260 default y 261 help 262 Enable this to plug hisilicon's thermal sensor driver into the Linux 263 thermal framework. cpufreq is used as the cooling device to throttle 264 CPUs when the passive trip is crossed. 265 266config IMX_THERMAL 267 tristate "Temperature sensor driver for Freescale i.MX SoCs" 268 depends on ARCH_MXC || COMPILE_TEST 269 depends on NVMEM || !NVMEM 270 depends on MFD_SYSCON 271 depends on OF 272 help 273 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 274 It supports one critical trip point and one passive trip point. The 275 cpufreq is used as the cooling device to throttle CPUs when the 276 passive trip is crossed. 277 278config IMX_SC_THERMAL 279 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller" 280 depends on IMX_SCU 281 depends on OF 282 help 283 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with 284 system controller inside, Linux kernel has to communicate with system 285 controller via MU (message unit) IPC to get temperature from thermal 286 sensor. It supports one critical trip point and one 287 passive trip point for each thermal sensor. 288 289config IMX8MM_THERMAL 290 tristate "Temperature sensor driver for Freescale i.MX8MM SoC" 291 depends on ARCH_MXC || COMPILE_TEST 292 depends on OF 293 help 294 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC. 295 It supports one critical trip point and one passive trip point. The 296 cpufreq is used as the cooling device to throttle CPUs when the passive 297 trip is crossed. 298 299config K3_THERMAL 300 tristate "Texas Instruments K3 thermal support" 301 depends on ARCH_K3 || COMPILE_TEST 302 help 303 If you say yes here you get thermal support for the Texas Instruments 304 K3 SoC family. The current chip supported is: 305 - AM654 306 307 This includes temperature reading functionality. 308 309config MAX77620_THERMAL 310 tristate "Temperature sensor driver for Maxim MAX77620 PMIC" 311 depends on MFD_MAX77620 312 depends on OF 313 help 314 Support for die junction temperature warning alarm for Maxim 315 Semiconductor PMIC MAX77620 device. Device generates two alarm 316 interrupts when PMIC die temperature cross the threshold of 317 120 degC and 140 degC. 318 319config QORIQ_THERMAL 320 tristate "QorIQ Thermal Monitoring Unit" 321 depends on THERMAL_OF && HAS_IOMEM 322 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST 323 select REGMAP_MMIO 324 help 325 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms. 326 It supports one critical trip point and one passive trip point. The 327 cpufreq is used as the cooling device to throttle CPUs when the 328 passive trip is crossed. 329 330config SPEAR_THERMAL 331 tristate "SPEAr thermal sensor driver" 332 depends on PLAT_SPEAR || COMPILE_TEST 333 depends on HAS_IOMEM 334 depends on OF 335 help 336 Enable this to plug the SPEAr thermal sensor driver into the Linux 337 thermal framework. 338 339config SUN8I_THERMAL 340 tristate "Allwinner sun8i thermal driver" 341 depends on ARCH_SUNXI || COMPILE_TEST 342 depends on HAS_IOMEM 343 depends on NVMEM 344 depends on OF 345 depends on RESET_CONTROLLER 346 help 347 Support for the sun8i thermal sensor driver into the Linux thermal 348 framework. 349 350 To compile this driver as a module, choose M here: the 351 module will be called sun8i-thermal. 352 353config ROCKCHIP_THERMAL 354 tristate "Rockchip thermal driver" 355 depends on ARCH_ROCKCHIP || COMPILE_TEST 356 depends on RESET_CONTROLLER 357 depends on HAS_IOMEM 358 help 359 Rockchip thermal driver provides support for Temperature sensor 360 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 361 trip point. Cpufreq is used as the cooling device and will throttle 362 CPUs when the Temperature crosses the passive trip point. 363 364config KIRKWOOD_THERMAL 365 tristate "Temperature sensor on Marvell Kirkwood SoCs" 366 depends on MACH_KIRKWOOD || COMPILE_TEST 367 depends on HAS_IOMEM 368 depends on OF 369 help 370 Support for the Kirkwood thermal sensor driver into the Linux thermal 371 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 372 373config DOVE_THERMAL 374 tristate "Temperature sensor on Marvell Dove SoCs" 375 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 376 depends on HAS_IOMEM 377 depends on OF 378 help 379 Support for the Dove thermal sensor driver in the Linux thermal 380 framework. 381 382config DB8500_THERMAL 383 tristate "DB8500 thermal management" 384 depends on MFD_DB8500_PRCMU && OF 385 default y 386 help 387 Adds DB8500 thermal management implementation according to the thermal 388 management framework. A thermal zone with several trip points will be 389 created. Cooling devices can be bound to the trip points to cool this 390 thermal zone if trip points reached. 391 392config ARMADA_THERMAL 393 tristate "Marvell EBU Armada SoCs thermal management" 394 depends on ARCH_MVEBU || COMPILE_TEST 395 depends on HAS_IOMEM 396 depends on OF 397 help 398 Enable this option if you want to have support for thermal management 399 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K). 400 401config DA9062_THERMAL 402 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver" 403 depends on MFD_DA9062 || COMPILE_TEST 404 depends on OF 405 help 406 Enable this for the Dialog Semiconductor thermal sensor driver. 407 This will report PMIC junction over-temperature for one thermal trip 408 zone. 409 Compatible with the DA9062 and DA9061 PMICs. 410 411menu "Mediatek thermal drivers" 412depends on ARCH_MEDIATEK || COMPILE_TEST 413source "drivers/thermal/mediatek/Kconfig" 414endmenu 415 416config AMLOGIC_THERMAL 417 tristate "Amlogic Thermal Support" 418 default ARCH_MESON 419 depends on OF && ARCH_MESON 420 help 421 If you say yes here you get support for Amlogic Thermal 422 for G12 SoC Family. 423 424 This driver can also be built as a module. If so, the module will 425 be called amlogic_thermal. 426 427menu "Intel thermal drivers" 428depends on X86 || X86_INTEL_QUARK || COMPILE_TEST 429source "drivers/thermal/intel/Kconfig" 430endmenu 431 432menu "Broadcom thermal drivers" 433depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \ 434 COMPILE_TEST 435source "drivers/thermal/broadcom/Kconfig" 436endmenu 437 438menu "Texas Instruments thermal drivers" 439depends on ARCH_HAS_BANDGAP || COMPILE_TEST 440depends on HAS_IOMEM 441source "drivers/thermal/ti-soc-thermal/Kconfig" 442endmenu 443 444menu "Samsung thermal drivers" 445depends on ARCH_EXYNOS || COMPILE_TEST 446source "drivers/thermal/samsung/Kconfig" 447endmenu 448 449menu "STMicroelectronics thermal drivers" 450depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF 451source "drivers/thermal/st/Kconfig" 452endmenu 453 454source "drivers/thermal/renesas/Kconfig" 455 456source "drivers/thermal/tegra/Kconfig" 457 458config GENERIC_ADC_THERMAL 459 tristate "Generic ADC based thermal sensor" 460 depends on IIO 461 help 462 This enabled a thermal sysfs driver for the temperature sensor 463 which is connected to the General Purpose ADC. The ADC channel 464 is read via IIO framework and the channel information is provided 465 to this driver. This driver reports the temperature by reading ADC 466 channel and converts it to temperature based on lookup table. 467 468menu "Qualcomm thermal drivers" 469depends on (ARCH_QCOM && OF) || COMPILE_TEST 470source "drivers/thermal/qcom/Kconfig" 471endmenu 472 473config UNIPHIER_THERMAL 474 tristate "Socionext UniPhier thermal driver" 475 depends on ARCH_UNIPHIER || COMPILE_TEST 476 depends on THERMAL_OF && MFD_SYSCON 477 help 478 Enable this to plug in UniPhier on-chip PVT thermal driver into the 479 thermal framework. The driver supports CPU thermal zone temperature 480 reporting and a couple of trip points. 481 482config SPRD_THERMAL 483 tristate "Temperature sensor on Spreadtrum SoCs" 484 depends on ARCH_SPRD || COMPILE_TEST 485 help 486 Support for the Spreadtrum thermal sensor driver in the Linux thermal 487 framework. 488 489config KHADAS_MCU_FAN_THERMAL 490 tristate "Khadas MCU controller FAN cooling support" 491 depends on OF 492 depends on MFD_KHADAS_MCU 493 select MFD_CORE 494 select REGMAP 495 help 496 If you say yes here you get support for the FAN controlled 497 by the Microcontroller found on the Khadas VIM boards. 498 499config LOONGSON2_THERMAL 500 tristate "Loongson-2 SoC series thermal driver" 501 depends on LOONGARCH || COMPILE_TEST 502 depends on OF 503 help 504 Support for Thermal driver found on Loongson-2 SoC series platforms. 505 The thermal driver realizes get_temp and set_trips function, which 506 are used to obtain the temperature of the current node and set the 507 temperature range to trigger the interrupt. When the input temperature 508 is higher than the high temperature threshold or lower than the low 509 temperature threshold, the interrupt will occur. 510 511endif 512