xref: /linux/drivers/thermal/Kconfig (revision 5b9b41617bf3e1282cc60f07d3d52e62399aa4ba)
1# SPDX-License-Identifier: GPL-2.0-only
2#
3# Generic thermal drivers configuration
4#
5
6menuconfig THERMAL
7	bool "Thermal drivers"
8	help
9	  Thermal drivers offer a generic mechanism for
10	  thermal management. Usually it's made up of one or more thermal
11	  zones and cooling devices.
12	  Each thermal zone contains its own temperature, trip points,
13	  and cooling devices.
14	  All platforms with ACPI or Open Firmware thermal support can use
15	  this driver.
16	  If you want this support, you should say Y here.
17
18if THERMAL
19
20config THERMAL_NETLINK
21	bool "Thermal netlink management"
22	depends on NET
23	help
24	  The thermal framework has a netlink interface to do thermal
25	  zones discovery, temperature readings and events such as
26	  trip point crossed, cooling device update or governor
27	  change. It is recommended to enable the feature.
28
29config THERMAL_STATISTICS
30	bool "Thermal state transition statistics"
31	help
32	  Export thermal state transition statistics information through sysfs.
33
34	  If in doubt, say N.
35
36config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
37	int "Emergency poweroff delay in milli-seconds"
38	default 0
39	help
40	  Thermal subsystem will issue a graceful shutdown when
41	  critical temperatures are reached using orderly_poweroff(). In
42	  case of failure of an orderly_poweroff(), the thermal emergency
43	  poweroff kicks in after a delay has elapsed and shuts down the system.
44	  This config is number of milliseconds to delay before emergency
45	  poweroff kicks in. Similarly to the critical trip point,
46	  the delay should be carefully profiled so as to give adequate
47	  time for orderly_poweroff() to finish on regular execution.
48	  If set to 0 emergency poweroff will not be supported.
49
50	  In doubt, leave as 0.
51
52config THERMAL_HWMON
53	bool
54	prompt "Expose thermal sensors as hwmon device"
55	depends on HWMON=y || HWMON=THERMAL
56	default y
57	help
58	  In case a sensor is registered with the thermal
59	  framework, this option will also register it
60	  as a hwmon. The sensor will then have the common
61	  hwmon sysfs interface.
62
63	  Say 'Y' here if you want all thermal sensors to
64	  have hwmon sysfs interface too.
65
66config THERMAL_OF
67	bool
68	prompt "APIs to parse thermal data out of device tree"
69	depends on OF
70	default y
71	help
72	  This options provides helpers to add the support to
73	  read and parse thermal data definitions out of the
74	  device tree blob.
75
76	  Say 'Y' here if you need to build thermal infrastructure
77	  based on device tree.
78
79config THERMAL_WRITABLE_TRIPS
80	bool "Enable writable trip points"
81	help
82	  This option allows the system integrator to choose whether
83	  trip temperatures can be changed from userspace. The
84	  writable trips need to be specified when setting up the
85	  thermal zone but the choice here takes precedence.
86
87	  Say 'Y' here if you would like to allow userspace tools to
88	  change trip temperatures.
89
90choice
91	prompt "Default Thermal governor"
92	default THERMAL_DEFAULT_GOV_STEP_WISE
93	help
94	  This option sets which thermal governor shall be loaded at
95	  startup. If in doubt, select 'step_wise'.
96
97config THERMAL_DEFAULT_GOV_STEP_WISE
98	bool "step_wise"
99	select THERMAL_GOV_STEP_WISE
100	help
101	  Use the step_wise governor as default. This throttles the
102	  devices one step at a time.
103
104config THERMAL_DEFAULT_GOV_FAIR_SHARE
105	bool "fair_share"
106	select THERMAL_GOV_FAIR_SHARE
107	help
108	  Use the fair_share governor as default. This throttles the
109	  devices based on their 'contribution' to a zone. The
110	  contribution should be provided through platform data.
111
112config THERMAL_DEFAULT_GOV_USER_SPACE
113	bool "user_space"
114	select THERMAL_GOV_USER_SPACE
115	help
116	  The Userspace governor allows to get trip point crossed
117	  notification from the kernel via uevents. It is recommended
118	  to use the netlink interface instead which gives richer
119	  information about the thermal framework events.
120
121config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
122	bool "power_allocator"
123	depends on THERMAL_GOV_POWER_ALLOCATOR
124	help
125	  Select this if you want to control temperature based on
126	  system and device power allocation. This governor can only
127	  operate on cooling devices that implement the power API.
128
129config THERMAL_DEFAULT_GOV_BANG_BANG
130	bool "bang_bang"
131	depends on THERMAL_GOV_BANG_BANG
132	help
133	  Use the bang_bang governor as default. This throttles the
134	  devices one step at the time, taking into account the trip
135	  point hysteresis.
136
137endchoice
138
139config THERMAL_GOV_FAIR_SHARE
140	bool "Fair-share thermal governor"
141	help
142	  Enable this to manage platform thermals using fair-share governor.
143
144config THERMAL_GOV_STEP_WISE
145	bool "Step_wise thermal governor"
146	help
147	  Enable this to manage platform thermals using a simple linear
148	  governor.
149
150config THERMAL_GOV_BANG_BANG
151	bool "Bang Bang thermal governor"
152	default n
153	help
154	  Enable this to manage platform thermals using bang bang governor.
155
156	  Say 'Y' here if you want to use two point temperature regulation
157	  used for fans without throttling.  Some fan drivers depend on this
158	  governor to be enabled (e.g. acerhdf).
159
160config THERMAL_GOV_USER_SPACE
161	bool "User_space thermal governor"
162	help
163	  Enable this to let the user space manage the platform thermals.
164
165config THERMAL_GOV_POWER_ALLOCATOR
166	bool "Power allocator thermal governor"
167	depends on ENERGY_MODEL
168	help
169	  Enable this to manage platform thermals by dynamically
170	  allocating and limiting power to devices.
171
172config CPU_THERMAL
173	bool "Generic cpu cooling support"
174	depends on THERMAL_OF
175	help
176	  Enable the CPU cooling features. If the system has no active
177	  cooling device available, this option allows to use the CPU
178	  as a cooling device.
179
180if CPU_THERMAL
181
182config CPU_FREQ_THERMAL
183	bool "CPU frequency cooling device"
184	depends on CPU_FREQ
185	default y
186	help
187	  This implements the generic cpu cooling mechanism through frequency
188	  reduction. An ACPI version of this already exists
189	  (drivers/acpi/processor_thermal.c).
190	  This will be useful for platforms using the generic thermal interface
191	  and not the ACPI interface.
192
193config CPU_IDLE_THERMAL
194	bool "CPU idle cooling device"
195	depends on IDLE_INJECT
196	help
197	  This implements the CPU cooling mechanism through
198	  idle injection. This will throttle the CPU by injecting
199	  idle cycle.
200endif
201
202config DEVFREQ_THERMAL
203	bool "Generic device cooling support"
204	depends on PM_DEVFREQ
205	depends on PM_OPP
206	help
207	  This implements the generic devfreq cooling mechanism through
208	  frequency reduction for devices using devfreq.
209
210	  This will throttle the device by limiting the maximum allowed DVFS
211	  frequency corresponding to the cooling level.
212
213	  In order to use the power extensions of the cooling device,
214	  devfreq should use the simple_ondemand governor.
215
216	  If you want this support, you should say Y here.
217
218config THERMAL_EMULATION
219	bool "Thermal emulation mode support"
220	help
221	  Enable this option to make a emul_temp sysfs node in thermal zone
222	  directory to support temperature emulation. With emulation sysfs node,
223	  user can manually input temperature and test the different trip
224	  threshold behaviour for simulation purpose.
225
226	  WARNING: Be careful while enabling this option on production systems,
227	  because userland can easily disable the thermal policy by simply
228	  flooding this sysfs node with low temperature values.
229
230config THERMAL_MMIO
231	tristate "Generic Thermal MMIO driver"
232	depends on OF
233	depends on HAS_IOMEM
234	help
235	  This option enables the generic thermal MMIO driver that will use
236	  memory-mapped reads to get the temperature.  Any HW/System that
237	  allows temperature reading by a single memory-mapped reading, be it
238	  register or shared memory, is a potential candidate to work with this
239	  driver.
240
241config HISI_THERMAL
242	tristate "Hisilicon thermal driver"
243	depends on ARCH_HISI || COMPILE_TEST
244	depends on HAS_IOMEM
245	depends on OF
246	default y
247	help
248	  Enable this to plug hisilicon's thermal sensor driver into the Linux
249	  thermal framework. cpufreq is used as the cooling device to throttle
250	  CPUs when the passive trip is crossed.
251
252config IMX_THERMAL
253	tristate "Temperature sensor driver for Freescale i.MX SoCs"
254	depends on ARCH_MXC || COMPILE_TEST
255	depends on NVMEM || !NVMEM
256	depends on MFD_SYSCON
257	depends on OF
258	help
259	  Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
260	  It supports one critical trip point and one passive trip point.  The
261	  cpufreq is used as the cooling device to throttle CPUs when the
262	  passive trip is crossed.
263
264config IMX_SC_THERMAL
265	tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
266	depends on IMX_SCU
267	depends on OF
268	help
269	  Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
270	  system controller inside, Linux kernel has to communicate with system
271	  controller via MU (message unit) IPC to get temperature from thermal
272	  sensor. It supports one critical trip point and one
273	  passive trip point for each thermal sensor.
274
275config IMX8MM_THERMAL
276	tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
277	depends on ARCH_MXC || COMPILE_TEST
278	depends on OF
279	help
280	  Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
281	  It supports one critical trip point and one passive trip point. The
282	  cpufreq is used as the cooling device to throttle CPUs when the passive
283	  trip is crossed.
284
285config K3_THERMAL
286	tristate "Texas Instruments K3 thermal support"
287	depends on ARCH_K3 || COMPILE_TEST
288	help
289	  If you say yes here you get thermal support for the Texas Instruments
290	  K3 SoC family. The current chip supported is:
291	  - AM654
292
293	  This includes temperature reading functionality.
294
295config MAX77620_THERMAL
296	tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
297	depends on MFD_MAX77620
298	depends on OF
299	help
300	  Support for die junction temperature warning alarm for Maxim
301	  Semiconductor PMIC MAX77620 device. Device generates two alarm
302	  interrupts when PMIC die temperature cross the threshold of
303	  120 degC and 140 degC.
304
305config QORIQ_THERMAL
306	tristate "QorIQ Thermal Monitoring Unit"
307	depends on THERMAL_OF && HAS_IOMEM
308	depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
309	select REGMAP_MMIO
310	help
311	  Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
312	  It supports one critical trip point and one passive trip point. The
313	  cpufreq is used as the cooling device to throttle CPUs when the
314	  passive trip is crossed.
315
316config SPEAR_THERMAL
317	tristate "SPEAr thermal sensor driver"
318	depends on PLAT_SPEAR || COMPILE_TEST
319	depends on HAS_IOMEM
320	depends on OF
321	help
322	  Enable this to plug the SPEAr thermal sensor driver into the Linux
323	  thermal framework.
324
325config SUN8I_THERMAL
326	tristate "Allwinner sun8i thermal driver"
327	depends on ARCH_SUNXI || COMPILE_TEST
328	depends on HAS_IOMEM
329	depends on NVMEM
330	depends on OF
331	depends on RESET_CONTROLLER
332	help
333	  Support for the sun8i thermal sensor driver into the Linux thermal
334	  framework.
335
336	  To compile this driver as a module, choose M here: the
337	  module will be called sun8i-thermal.
338
339config ROCKCHIP_THERMAL
340	tristate "Rockchip thermal driver"
341	depends on ARCH_ROCKCHIP || COMPILE_TEST
342	depends on RESET_CONTROLLER
343	depends on HAS_IOMEM
344	help
345	  Rockchip thermal driver provides support for Temperature sensor
346	  ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
347	  trip point. Cpufreq is used as the cooling device and will throttle
348	  CPUs when the Temperature crosses the passive trip point.
349
350config RCAR_THERMAL
351	tristate "Renesas R-Car thermal driver"
352	depends on ARCH_RENESAS || COMPILE_TEST
353	depends on HAS_IOMEM
354	help
355	  Enable this to plug the R-Car thermal sensor driver into the Linux
356	  thermal framework.
357
358config RCAR_GEN3_THERMAL
359	tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver"
360	depends on ARCH_RENESAS || COMPILE_TEST
361	depends on HAS_IOMEM
362	depends on OF
363	help
364	  Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into
365	  the Linux thermal framework.
366
367config RZG2L_THERMAL
368	tristate "Renesas RZ/G2L thermal driver"
369	depends on ARCH_RENESAS || COMPILE_TEST
370	depends on HAS_IOMEM
371	depends on OF
372	help
373	  Enable this to plug the RZ/G2L thermal sensor driver into the Linux
374	  thermal framework.
375
376config KIRKWOOD_THERMAL
377	tristate "Temperature sensor on Marvell Kirkwood SoCs"
378	depends on MACH_KIRKWOOD || COMPILE_TEST
379	depends on HAS_IOMEM
380	depends on OF
381	help
382	  Support for the Kirkwood thermal sensor driver into the Linux thermal
383	  framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
384
385config DOVE_THERMAL
386	tristate "Temperature sensor on Marvell Dove SoCs"
387	depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
388	depends on HAS_IOMEM
389	depends on OF
390	help
391	  Support for the Dove thermal sensor driver in the Linux thermal
392	  framework.
393
394config DB8500_THERMAL
395	tristate "DB8500 thermal management"
396	depends on MFD_DB8500_PRCMU && OF
397	default y
398	help
399	  Adds DB8500 thermal management implementation according to the thermal
400	  management framework. A thermal zone with several trip points will be
401	  created. Cooling devices can be bound to the trip points to cool this
402	  thermal zone if trip points reached.
403
404config ARMADA_THERMAL
405	tristate "Marvell EBU Armada SoCs thermal management"
406	depends on ARCH_MVEBU || COMPILE_TEST
407	depends on HAS_IOMEM
408	depends on OF
409	help
410	  Enable this option if you want to have support for thermal management
411	  controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
412
413config DA9062_THERMAL
414	tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
415	depends on MFD_DA9062 || COMPILE_TEST
416	depends on OF
417	help
418	  Enable this for the Dialog Semiconductor thermal sensor driver.
419	  This will report PMIC junction over-temperature for one thermal trip
420	  zone.
421	  Compatible with the DA9062 and DA9061 PMICs.
422
423menu "Mediatek thermal drivers"
424depends on ARCH_MEDIATEK || COMPILE_TEST
425source "drivers/thermal/mediatek/Kconfig"
426endmenu
427
428config AMLOGIC_THERMAL
429	tristate "Amlogic Thermal Support"
430	default ARCH_MESON
431	depends on OF && ARCH_MESON
432	help
433	  If you say yes here you get support for Amlogic Thermal
434	  for G12 SoC Family.
435
436	  This driver can also be built as a module. If so, the module will
437	  be called amlogic_thermal.
438
439menu "Intel thermal drivers"
440depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
441source "drivers/thermal/intel/Kconfig"
442endmenu
443
444menu "Broadcom thermal drivers"
445depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
446		COMPILE_TEST
447source "drivers/thermal/broadcom/Kconfig"
448endmenu
449
450menu "Texas Instruments thermal drivers"
451depends on ARCH_HAS_BANDGAP || COMPILE_TEST
452depends on HAS_IOMEM
453source "drivers/thermal/ti-soc-thermal/Kconfig"
454endmenu
455
456menu "Samsung thermal drivers"
457depends on ARCH_EXYNOS || COMPILE_TEST
458source "drivers/thermal/samsung/Kconfig"
459endmenu
460
461menu "STMicroelectronics thermal drivers"
462depends on (ARCH_STI || ARCH_STM32) && OF
463source "drivers/thermal/st/Kconfig"
464endmenu
465
466source "drivers/thermal/tegra/Kconfig"
467
468config GENERIC_ADC_THERMAL
469	tristate "Generic ADC based thermal sensor"
470	depends on IIO
471	help
472	  This enabled a thermal sysfs driver for the temperature sensor
473	  which is connected to the General Purpose ADC. The ADC channel
474	  is read via IIO framework and the channel information is provided
475	  to this driver. This driver reports the temperature by reading ADC
476	  channel and converts it to temperature based on lookup table.
477
478menu "Qualcomm thermal drivers"
479depends on (ARCH_QCOM && OF) || COMPILE_TEST
480source "drivers/thermal/qcom/Kconfig"
481endmenu
482
483config UNIPHIER_THERMAL
484	tristate "Socionext UniPhier thermal driver"
485	depends on ARCH_UNIPHIER || COMPILE_TEST
486	depends on THERMAL_OF && MFD_SYSCON
487	help
488	  Enable this to plug in UniPhier on-chip PVT thermal driver into the
489	  thermal framework. The driver supports CPU thermal zone temperature
490	  reporting and a couple of trip points.
491
492config SPRD_THERMAL
493	tristate "Temperature sensor on Spreadtrum SoCs"
494	depends on ARCH_SPRD || COMPILE_TEST
495	help
496	  Support for the Spreadtrum thermal sensor driver in the Linux thermal
497	  framework.
498
499config KHADAS_MCU_FAN_THERMAL
500	tristate "Khadas MCU controller FAN cooling support"
501	depends on OF
502	depends on MFD_KHADAS_MCU
503	select MFD_CORE
504	select REGMAP
505	help
506	  If you say yes here you get support for the FAN controlled
507	  by the Microcontroller found on the Khadas VIM boards.
508
509config LOONGSON2_THERMAL
510	tristate "Loongson-2 SoC series thermal driver"
511	depends on LOONGARCH || COMPILE_TEST
512	depends on OF
513	help
514	  Support for Thermal driver found on Loongson-2 SoC series platforms.
515	  The thermal driver realizes get_temp and set_trips function, which
516	  are used to obtain the temperature of the current node and set the
517	  temperature range to trigger the interrupt. When the input temperature
518	  is higher than the high temperature threshold or lower than the low
519	  temperature threshold, the interrupt will occur.
520
521endif
522