1# SPDX-License-Identifier: GPL-2.0-only 2# 3# Generic thermal drivers configuration 4# 5 6menuconfig THERMAL 7 bool "Thermal drivers" 8 help 9 Thermal drivers offer a generic mechanism for 10 thermal management. Usually it's made up of one or more thermal 11 zones and cooling devices. 12 Each thermal zone contains its own temperature, trip points, 13 and cooling devices. 14 All platforms with ACPI or Open Firmware thermal support can use 15 this driver. 16 If you want this support, you should say Y here. 17 18if THERMAL 19 20config THERMAL_NETLINK 21 bool "Thermal netlink management" 22 depends on NET 23 help 24 The thermal framework has a netlink interface to do thermal 25 zones discovery, temperature readings and events such as 26 trip point crossed, cooling device update or governor 27 change. It is recommended to enable the feature. 28 29config THERMAL_STATISTICS 30 bool "Thermal state transition statistics" 31 help 32 Export thermal state transition statistics information through sysfs. 33 34 If in doubt, say N. 35 36config THERMAL_DEBUGFS 37 bool "Thermal subsystem debug support" 38 depends on DEBUG_FS 39 help 40 Say Y to allow the thermal subsystem to collect diagnostic 41 information that can be accessed via debugfs. 42 43config THERMAL_EMERGENCY_POWEROFF_DELAY_MS 44 int "Emergency poweroff delay in milli-seconds" 45 default 0 46 help 47 Thermal subsystem will issue a graceful shutdown when 48 critical temperatures are reached using orderly_poweroff(). In 49 case of failure of an orderly_poweroff(), the thermal emergency 50 poweroff kicks in after a delay has elapsed and shuts down the system. 51 This config is number of milliseconds to delay before emergency 52 poweroff kicks in. Similarly to the critical trip point, 53 the delay should be carefully profiled so as to give adequate 54 time for orderly_poweroff() to finish on regular execution. 55 If set to 0 emergency poweroff will not be supported. 56 57 In doubt, leave as 0. 58 59config THERMAL_HWMON 60 bool 61 prompt "Expose thermal sensors as hwmon device" 62 depends on HWMON=y || HWMON=THERMAL 63 default y 64 help 65 In case a sensor is registered with the thermal 66 framework, this option will also register it 67 as a hwmon. The sensor will then have the common 68 hwmon sysfs interface. 69 70 Say 'Y' here if you want all thermal sensors to 71 have hwmon sysfs interface too. 72 73config THERMAL_OF 74 bool 75 prompt "APIs to parse thermal data out of device tree" 76 depends on OF 77 default y 78 help 79 This options provides helpers to add the support to 80 read and parse thermal data definitions out of the 81 device tree blob. 82 83 Say 'Y' here if you need to build thermal infrastructure 84 based on device tree. 85 86choice 87 prompt "Default Thermal governor" 88 default THERMAL_DEFAULT_GOV_STEP_WISE 89 help 90 This option sets which thermal governor shall be loaded at 91 startup. If in doubt, select 'step_wise'. 92 93config THERMAL_DEFAULT_GOV_STEP_WISE 94 bool "step_wise" 95 select THERMAL_GOV_STEP_WISE 96 help 97 Use the step_wise governor as default. This throttles the 98 devices one step at a time. 99 100config THERMAL_DEFAULT_GOV_FAIR_SHARE 101 bool "fair_share" 102 select THERMAL_GOV_FAIR_SHARE 103 help 104 Use the fair_share governor as default. This throttles the 105 devices based on their 'contribution' to a zone. The 106 contribution should be provided through platform data. 107 108config THERMAL_DEFAULT_GOV_USER_SPACE 109 bool "user_space" 110 select THERMAL_GOV_USER_SPACE 111 help 112 The Userspace governor allows to get trip point crossed 113 notification from the kernel via uevents. It is recommended 114 to use the netlink interface instead which gives richer 115 information about the thermal framework events. 116 117config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 118 bool "power_allocator" 119 depends on THERMAL_GOV_POWER_ALLOCATOR 120 help 121 Select this if you want to control temperature based on 122 system and device power allocation. This governor can only 123 operate on cooling devices that implement the power API. 124 125config THERMAL_DEFAULT_GOV_BANG_BANG 126 bool "bang_bang" 127 depends on THERMAL_GOV_BANG_BANG 128 help 129 Use the bang_bang governor as default. This throttles the 130 devices one step at the time, taking into account the trip 131 point hysteresis. 132 133endchoice 134 135config THERMAL_GOV_FAIR_SHARE 136 bool "Fair-share thermal governor" 137 help 138 Enable this to manage platform thermals using fair-share governor. 139 140config THERMAL_GOV_STEP_WISE 141 bool "Step_wise thermal governor" 142 help 143 Enable this to manage platform thermals using a simple linear 144 governor. 145 146config THERMAL_GOV_BANG_BANG 147 bool "Bang Bang thermal governor" 148 default n 149 help 150 Enable this to manage platform thermals using bang bang governor. 151 152 Say 'Y' here if you want to use two point temperature regulation 153 used for fans without throttling. Some fan drivers depend on this 154 governor to be enabled (e.g. acerhdf). 155 156config THERMAL_GOV_USER_SPACE 157 bool "User_space thermal governor" 158 help 159 Enable this to let the user space manage the platform thermals. 160 161config THERMAL_GOV_POWER_ALLOCATOR 162 bool "Power allocator thermal governor" 163 depends on ENERGY_MODEL 164 help 165 Enable this to manage platform thermals by dynamically 166 allocating and limiting power to devices. 167 168config CPU_THERMAL 169 bool "Generic cpu cooling support" 170 depends on THERMAL_OF 171 help 172 Enable the CPU cooling features. If the system has no active 173 cooling device available, this option allows to use the CPU 174 as a cooling device. 175 176if CPU_THERMAL 177 178config CPU_FREQ_THERMAL 179 bool "CPU frequency cooling device" 180 depends on CPU_FREQ 181 default y 182 help 183 This implements the generic cpu cooling mechanism through frequency 184 reduction. An ACPI version of this already exists 185 (drivers/acpi/processor_thermal.c). 186 This will be useful for platforms using the generic thermal interface 187 and not the ACPI interface. 188 189config CPU_IDLE_THERMAL 190 bool "CPU idle cooling device" 191 depends on IDLE_INJECT 192 help 193 This implements the CPU cooling mechanism through 194 idle injection. This will throttle the CPU by injecting 195 idle cycle. 196endif 197 198config DEVFREQ_THERMAL 199 bool "Generic device cooling support" 200 depends on PM_DEVFREQ 201 depends on PM_OPP 202 help 203 This implements the generic devfreq cooling mechanism through 204 frequency reduction for devices using devfreq. 205 206 This will throttle the device by limiting the maximum allowed DVFS 207 frequency corresponding to the cooling level. 208 209 In order to use the power extensions of the cooling device, 210 devfreq should use the simple_ondemand governor. 211 212 If you want this support, you should say Y here. 213 214config THERMAL_EMULATION 215 bool "Thermal emulation mode support" 216 help 217 Enable this option to make a emul_temp sysfs node in thermal zone 218 directory to support temperature emulation. With emulation sysfs node, 219 user can manually input temperature and test the different trip 220 threshold behaviour for simulation purpose. 221 222 WARNING: Be careful while enabling this option on production systems, 223 because userland can easily disable the thermal policy by simply 224 flooding this sysfs node with low temperature values. 225 226config THERMAL_MMIO 227 tristate "Generic Thermal MMIO driver" 228 depends on OF 229 depends on HAS_IOMEM 230 help 231 This option enables the generic thermal MMIO driver that will use 232 memory-mapped reads to get the temperature. Any HW/System that 233 allows temperature reading by a single memory-mapped reading, be it 234 register or shared memory, is a potential candidate to work with this 235 driver. 236 237config HISI_THERMAL 238 tristate "Hisilicon thermal driver" 239 depends on ARCH_HISI || COMPILE_TEST 240 depends on HAS_IOMEM 241 depends on OF 242 default y 243 help 244 Enable this to plug hisilicon's thermal sensor driver into the Linux 245 thermal framework. cpufreq is used as the cooling device to throttle 246 CPUs when the passive trip is crossed. 247 248config IMX_THERMAL 249 tristate "Temperature sensor driver for Freescale i.MX SoCs" 250 depends on ARCH_MXC || COMPILE_TEST 251 depends on NVMEM || !NVMEM 252 depends on MFD_SYSCON 253 depends on OF 254 help 255 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 256 It supports one critical trip point and one passive trip point. The 257 cpufreq is used as the cooling device to throttle CPUs when the 258 passive trip is crossed. 259 260config IMX_SC_THERMAL 261 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller" 262 depends on IMX_SCU 263 depends on OF 264 help 265 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with 266 system controller inside, Linux kernel has to communicate with system 267 controller via MU (message unit) IPC to get temperature from thermal 268 sensor. It supports one critical trip point and one 269 passive trip point for each thermal sensor. 270 271config IMX8MM_THERMAL 272 tristate "Temperature sensor driver for Freescale i.MX8MM SoC" 273 depends on ARCH_MXC || COMPILE_TEST 274 depends on OF 275 help 276 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC. 277 It supports one critical trip point and one passive trip point. The 278 cpufreq is used as the cooling device to throttle CPUs when the passive 279 trip is crossed. 280 281config K3_THERMAL 282 tristate "Texas Instruments K3 thermal support" 283 depends on ARCH_K3 || COMPILE_TEST 284 help 285 If you say yes here you get thermal support for the Texas Instruments 286 K3 SoC family. The current chip supported is: 287 - AM654 288 289 This includes temperature reading functionality. 290 291config MAX77620_THERMAL 292 tristate "Temperature sensor driver for Maxim MAX77620 PMIC" 293 depends on MFD_MAX77620 294 depends on OF 295 help 296 Support for die junction temperature warning alarm for Maxim 297 Semiconductor PMIC MAX77620 device. Device generates two alarm 298 interrupts when PMIC die temperature cross the threshold of 299 120 degC and 140 degC. 300 301config QORIQ_THERMAL 302 tristate "QorIQ Thermal Monitoring Unit" 303 depends on THERMAL_OF && HAS_IOMEM 304 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST 305 select REGMAP_MMIO 306 help 307 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms. 308 It supports one critical trip point and one passive trip point. The 309 cpufreq is used as the cooling device to throttle CPUs when the 310 passive trip is crossed. 311 312config SPEAR_THERMAL 313 tristate "SPEAr thermal sensor driver" 314 depends on PLAT_SPEAR || COMPILE_TEST 315 depends on HAS_IOMEM 316 depends on OF 317 help 318 Enable this to plug the SPEAr thermal sensor driver into the Linux 319 thermal framework. 320 321config SUN8I_THERMAL 322 tristate "Allwinner sun8i thermal driver" 323 depends on ARCH_SUNXI || COMPILE_TEST 324 depends on HAS_IOMEM 325 depends on NVMEM 326 depends on OF 327 depends on RESET_CONTROLLER 328 help 329 Support for the sun8i thermal sensor driver into the Linux thermal 330 framework. 331 332 To compile this driver as a module, choose M here: the 333 module will be called sun8i-thermal. 334 335config ROCKCHIP_THERMAL 336 tristate "Rockchip thermal driver" 337 depends on ARCH_ROCKCHIP || COMPILE_TEST 338 depends on RESET_CONTROLLER 339 depends on HAS_IOMEM 340 help 341 Rockchip thermal driver provides support for Temperature sensor 342 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 343 trip point. Cpufreq is used as the cooling device and will throttle 344 CPUs when the Temperature crosses the passive trip point. 345 346config KIRKWOOD_THERMAL 347 tristate "Temperature sensor on Marvell Kirkwood SoCs" 348 depends on MACH_KIRKWOOD || COMPILE_TEST 349 depends on HAS_IOMEM 350 depends on OF 351 help 352 Support for the Kirkwood thermal sensor driver into the Linux thermal 353 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 354 355config DOVE_THERMAL 356 tristate "Temperature sensor on Marvell Dove SoCs" 357 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 358 depends on HAS_IOMEM 359 depends on OF 360 help 361 Support for the Dove thermal sensor driver in the Linux thermal 362 framework. 363 364config DB8500_THERMAL 365 tristate "DB8500 thermal management" 366 depends on MFD_DB8500_PRCMU && OF 367 default y 368 help 369 Adds DB8500 thermal management implementation according to the thermal 370 management framework. A thermal zone with several trip points will be 371 created. Cooling devices can be bound to the trip points to cool this 372 thermal zone if trip points reached. 373 374config ARMADA_THERMAL 375 tristate "Marvell EBU Armada SoCs thermal management" 376 depends on ARCH_MVEBU || COMPILE_TEST 377 depends on HAS_IOMEM 378 depends on OF 379 help 380 Enable this option if you want to have support for thermal management 381 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K). 382 383config DA9062_THERMAL 384 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver" 385 depends on MFD_DA9062 || COMPILE_TEST 386 depends on OF 387 help 388 Enable this for the Dialog Semiconductor thermal sensor driver. 389 This will report PMIC junction over-temperature for one thermal trip 390 zone. 391 Compatible with the DA9062 and DA9061 PMICs. 392 393menu "Mediatek thermal drivers" 394depends on ARCH_MEDIATEK || COMPILE_TEST 395source "drivers/thermal/mediatek/Kconfig" 396endmenu 397 398config AMLOGIC_THERMAL 399 tristate "Amlogic Thermal Support" 400 default ARCH_MESON 401 depends on OF && ARCH_MESON 402 help 403 If you say yes here you get support for Amlogic Thermal 404 for G12 SoC Family. 405 406 This driver can also be built as a module. If so, the module will 407 be called amlogic_thermal. 408 409menu "Intel thermal drivers" 410depends on X86 || X86_INTEL_QUARK || COMPILE_TEST 411source "drivers/thermal/intel/Kconfig" 412endmenu 413 414menu "Broadcom thermal drivers" 415depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \ 416 COMPILE_TEST 417source "drivers/thermal/broadcom/Kconfig" 418endmenu 419 420menu "Texas Instruments thermal drivers" 421depends on ARCH_HAS_BANDGAP || COMPILE_TEST 422depends on HAS_IOMEM 423source "drivers/thermal/ti-soc-thermal/Kconfig" 424endmenu 425 426menu "Samsung thermal drivers" 427depends on ARCH_EXYNOS || COMPILE_TEST 428source "drivers/thermal/samsung/Kconfig" 429endmenu 430 431menu "STMicroelectronics thermal drivers" 432depends on (ARCH_STI || ARCH_STM32) && OF 433source "drivers/thermal/st/Kconfig" 434endmenu 435 436source "drivers/thermal/renesas/Kconfig" 437 438source "drivers/thermal/tegra/Kconfig" 439 440config GENERIC_ADC_THERMAL 441 tristate "Generic ADC based thermal sensor" 442 depends on IIO 443 help 444 This enabled a thermal sysfs driver for the temperature sensor 445 which is connected to the General Purpose ADC. The ADC channel 446 is read via IIO framework and the channel information is provided 447 to this driver. This driver reports the temperature by reading ADC 448 channel and converts it to temperature based on lookup table. 449 450menu "Qualcomm thermal drivers" 451depends on (ARCH_QCOM && OF) || COMPILE_TEST 452source "drivers/thermal/qcom/Kconfig" 453endmenu 454 455config UNIPHIER_THERMAL 456 tristate "Socionext UniPhier thermal driver" 457 depends on ARCH_UNIPHIER || COMPILE_TEST 458 depends on THERMAL_OF && MFD_SYSCON 459 help 460 Enable this to plug in UniPhier on-chip PVT thermal driver into the 461 thermal framework. The driver supports CPU thermal zone temperature 462 reporting and a couple of trip points. 463 464config SPRD_THERMAL 465 tristate "Temperature sensor on Spreadtrum SoCs" 466 depends on ARCH_SPRD || COMPILE_TEST 467 help 468 Support for the Spreadtrum thermal sensor driver in the Linux thermal 469 framework. 470 471config KHADAS_MCU_FAN_THERMAL 472 tristate "Khadas MCU controller FAN cooling support" 473 depends on OF 474 depends on MFD_KHADAS_MCU 475 select MFD_CORE 476 select REGMAP 477 help 478 If you say yes here you get support for the FAN controlled 479 by the Microcontroller found on the Khadas VIM boards. 480 481config LOONGSON2_THERMAL 482 tristate "Loongson-2 SoC series thermal driver" 483 depends on LOONGARCH || COMPILE_TEST 484 depends on OF 485 help 486 Support for Thermal driver found on Loongson-2 SoC series platforms. 487 The thermal driver realizes get_temp and set_trips function, which 488 are used to obtain the temperature of the current node and set the 489 temperature range to trigger the interrupt. When the input temperature 490 is higher than the high temperature threshold or lower than the low 491 temperature threshold, the interrupt will occur. 492 493endif 494