1# SPDX-License-Identifier: GPL-2.0-only 2# 3# Generic thermal drivers configuration 4# 5 6menuconfig THERMAL 7 bool "Thermal drivers" 8 help 9 Thermal drivers offer a generic mechanism for 10 thermal management. Usually it's made up of one or more thermal 11 zones and cooling devices. 12 Each thermal zone contains its own temperature, trip points, 13 and cooling devices. 14 All platforms with ACPI or Open Firmware thermal support can use 15 this driver. 16 If you want this support, you should say Y here. 17 18if THERMAL 19 20config THERMAL_NETLINK 21 bool "Thermal netlink management" 22 depends on NET 23 help 24 The thermal framework has a netlink interface to do thermal 25 zones discovery, temperature readings and events such as 26 trip point crossed, cooling device update or governor 27 change. It is recommended to enable the feature. 28 29config THERMAL_STATISTICS 30 bool "Thermal state transition statistics" 31 help 32 Export thermal state transition statistics information through sysfs. 33 34 If in doubt, say N. 35 36config THERMAL_DEBUGFS 37 bool "Thermal subsystem debug support" 38 depends on DEBUG_FS 39 help 40 Say Y to allow the thermal subsystem to collect diagnostic 41 information that can be accessed via debugfs. 42 43config THERMAL_CORE_TESTING 44 tristate "Thermal core testing facility" 45 depends on DEBUG_FS 46 help 47 Say Y to add a debugfs-based thermal core testing facility. 48 It allows test thermal zones to be created and populated 49 with trip points in order to exercise the thermal core 50 functionality in a controlled way. 51 52config THERMAL_EMERGENCY_POWEROFF_DELAY_MS 53 int "Emergency poweroff delay in milli-seconds" 54 default 0 55 help 56 Thermal subsystem will issue a graceful shutdown when 57 critical temperatures are reached using orderly_poweroff(). In 58 case of failure of an orderly_poweroff(), the thermal emergency 59 poweroff kicks in after a delay has elapsed and shuts down the system. 60 This config is number of milliseconds to delay before emergency 61 poweroff kicks in. Similarly to the critical trip point, 62 the delay should be carefully profiled so as to give adequate 63 time for orderly_poweroff() to finish on regular execution. 64 If set to 0 emergency poweroff will not be supported. 65 66 In doubt, leave as 0. 67 68config THERMAL_HWMON 69 bool 70 prompt "Expose thermal sensors as hwmon device" 71 depends on HWMON=y || HWMON=THERMAL 72 default y 73 help 74 In case a sensor is registered with the thermal 75 framework, this option will also register it 76 as a hwmon. The sensor will then have the common 77 hwmon sysfs interface. 78 79 Say 'Y' here if you want all thermal sensors to 80 have hwmon sysfs interface too. 81 82config THERMAL_OF 83 bool 84 prompt "APIs to parse thermal data out of device tree" 85 depends on OF 86 default y 87 help 88 This options provides helpers to add the support to 89 read and parse thermal data definitions out of the 90 device tree blob. 91 92 Say 'Y' here if you need to build thermal infrastructure 93 based on device tree. 94 95choice 96 prompt "Default Thermal governor" 97 default THERMAL_DEFAULT_GOV_STEP_WISE 98 help 99 This option sets which thermal governor shall be loaded at 100 startup. If in doubt, select 'step_wise'. 101 102config THERMAL_DEFAULT_GOV_STEP_WISE 103 bool "step_wise" 104 select THERMAL_GOV_STEP_WISE 105 help 106 Use the step_wise governor as default. This throttles the 107 devices one step at a time. 108 109config THERMAL_DEFAULT_GOV_FAIR_SHARE 110 bool "fair_share" 111 select THERMAL_GOV_FAIR_SHARE 112 help 113 Use the fair_share governor as default. This throttles the 114 devices based on their 'contribution' to a zone. The 115 contribution should be provided through platform data. 116 117config THERMAL_DEFAULT_GOV_USER_SPACE 118 bool "user_space" 119 select THERMAL_GOV_USER_SPACE 120 help 121 The Userspace governor allows to get trip point crossed 122 notification from the kernel via uevents. It is recommended 123 to use the netlink interface instead which gives richer 124 information about the thermal framework events. 125 126config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 127 bool "power_allocator" 128 depends on THERMAL_GOV_POWER_ALLOCATOR 129 help 130 Select this if you want to control temperature based on 131 system and device power allocation. This governor can only 132 operate on cooling devices that implement the power API. 133 134config THERMAL_DEFAULT_GOV_BANG_BANG 135 bool "bang_bang" 136 depends on THERMAL_GOV_BANG_BANG 137 help 138 Use the bang_bang governor as default. This throttles the 139 devices one step at the time, taking into account the trip 140 point hysteresis. 141 142endchoice 143 144config THERMAL_GOV_FAIR_SHARE 145 bool "Fair-share thermal governor" 146 help 147 Enable this to manage platform thermals using fair-share governor. 148 149config THERMAL_GOV_STEP_WISE 150 bool "Step_wise thermal governor" 151 help 152 Enable this to manage platform thermals using a simple linear 153 governor. 154 155config THERMAL_GOV_BANG_BANG 156 bool "Bang Bang thermal governor" 157 default n 158 help 159 Enable this to manage platform thermals using bang bang governor. 160 161 Say 'Y' here if you want to use two point temperature regulation 162 used for fans without throttling. Some fan drivers depend on this 163 governor to be enabled (e.g. acerhdf). 164 165config THERMAL_GOV_USER_SPACE 166 bool "User_space thermal governor" 167 help 168 Enable this to let the user space manage the platform thermals. 169 170config THERMAL_GOV_POWER_ALLOCATOR 171 bool "Power allocator thermal governor" 172 depends on ENERGY_MODEL 173 help 174 Enable this to manage platform thermals by dynamically 175 allocating and limiting power to devices. 176 177config CPU_THERMAL 178 bool "Generic cpu cooling support" 179 depends on THERMAL_OF 180 help 181 Enable the CPU cooling features. If the system has no active 182 cooling device available, this option allows to use the CPU 183 as a cooling device. 184 185if CPU_THERMAL 186 187config CPU_FREQ_THERMAL 188 bool "CPU frequency cooling device" 189 depends on CPU_FREQ 190 default y 191 help 192 This implements the generic cpu cooling mechanism through frequency 193 reduction. An ACPI version of this already exists 194 (drivers/acpi/processor_thermal.c). 195 This will be useful for platforms using the generic thermal interface 196 and not the ACPI interface. 197 198config CPU_IDLE_THERMAL 199 bool "CPU idle cooling device" 200 depends on IDLE_INJECT 201 help 202 This implements the CPU cooling mechanism through 203 idle injection. This will throttle the CPU by injecting 204 idle cycle. 205endif 206 207config DEVFREQ_THERMAL 208 bool "Generic device cooling support" 209 depends on PM_DEVFREQ 210 depends on PM_OPP 211 help 212 This implements the generic devfreq cooling mechanism through 213 frequency reduction for devices using devfreq. 214 215 This will throttle the device by limiting the maximum allowed DVFS 216 frequency corresponding to the cooling level. 217 218 In order to use the power extensions of the cooling device, 219 devfreq should use the simple_ondemand governor. 220 221 If you want this support, you should say Y here. 222 223config THERMAL_EMULATION 224 bool "Thermal emulation mode support" 225 help 226 Enable this option to make a emul_temp sysfs node in thermal zone 227 directory to support temperature emulation. With emulation sysfs node, 228 user can manually input temperature and test the different trip 229 threshold behaviour for simulation purpose. 230 231 WARNING: Be careful while enabling this option on production systems, 232 because userland can easily disable the thermal policy by simply 233 flooding this sysfs node with low temperature values. 234 235config THERMAL_MMIO 236 tristate "Generic Thermal MMIO driver" 237 depends on OF 238 depends on HAS_IOMEM 239 help 240 This option enables the generic thermal MMIO driver that will use 241 memory-mapped reads to get the temperature. Any HW/System that 242 allows temperature reading by a single memory-mapped reading, be it 243 register or shared memory, is a potential candidate to work with this 244 driver. 245 246config HISI_THERMAL 247 tristate "Hisilicon thermal driver" 248 depends on ARCH_HISI || COMPILE_TEST 249 depends on HAS_IOMEM 250 depends on OF 251 default y 252 help 253 Enable this to plug hisilicon's thermal sensor driver into the Linux 254 thermal framework. cpufreq is used as the cooling device to throttle 255 CPUs when the passive trip is crossed. 256 257config IMX_THERMAL 258 tristate "Temperature sensor driver for Freescale i.MX SoCs" 259 depends on ARCH_MXC || COMPILE_TEST 260 depends on NVMEM || !NVMEM 261 depends on MFD_SYSCON 262 depends on OF 263 help 264 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 265 It supports one critical trip point and one passive trip point. The 266 cpufreq is used as the cooling device to throttle CPUs when the 267 passive trip is crossed. 268 269config IMX_SC_THERMAL 270 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller" 271 depends on IMX_SCU 272 depends on OF 273 help 274 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with 275 system controller inside, Linux kernel has to communicate with system 276 controller via MU (message unit) IPC to get temperature from thermal 277 sensor. It supports one critical trip point and one 278 passive trip point for each thermal sensor. 279 280config IMX8MM_THERMAL 281 tristate "Temperature sensor driver for Freescale i.MX8MM SoC" 282 depends on ARCH_MXC || COMPILE_TEST 283 depends on OF 284 help 285 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC. 286 It supports one critical trip point and one passive trip point. The 287 cpufreq is used as the cooling device to throttle CPUs when the passive 288 trip is crossed. 289 290config K3_THERMAL 291 tristate "Texas Instruments K3 thermal support" 292 depends on ARCH_K3 || COMPILE_TEST 293 help 294 If you say yes here you get thermal support for the Texas Instruments 295 K3 SoC family. The current chip supported is: 296 - AM654 297 298 This includes temperature reading functionality. 299 300config MAX77620_THERMAL 301 tristate "Temperature sensor driver for Maxim MAX77620 PMIC" 302 depends on MFD_MAX77620 303 depends on OF 304 help 305 Support for die junction temperature warning alarm for Maxim 306 Semiconductor PMIC MAX77620 device. Device generates two alarm 307 interrupts when PMIC die temperature cross the threshold of 308 120 degC and 140 degC. 309 310config QORIQ_THERMAL 311 tristate "QorIQ Thermal Monitoring Unit" 312 depends on THERMAL_OF && HAS_IOMEM 313 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST 314 select REGMAP_MMIO 315 help 316 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms. 317 It supports one critical trip point and one passive trip point. The 318 cpufreq is used as the cooling device to throttle CPUs when the 319 passive trip is crossed. 320 321config SPEAR_THERMAL 322 tristate "SPEAr thermal sensor driver" 323 depends on PLAT_SPEAR || COMPILE_TEST 324 depends on HAS_IOMEM 325 depends on OF 326 help 327 Enable this to plug the SPEAr thermal sensor driver into the Linux 328 thermal framework. 329 330config SUN8I_THERMAL 331 tristate "Allwinner sun8i thermal driver" 332 depends on ARCH_SUNXI || COMPILE_TEST 333 depends on HAS_IOMEM 334 depends on NVMEM 335 depends on OF 336 depends on RESET_CONTROLLER 337 help 338 Support for the sun8i thermal sensor driver into the Linux thermal 339 framework. 340 341 To compile this driver as a module, choose M here: the 342 module will be called sun8i-thermal. 343 344config ROCKCHIP_THERMAL 345 tristate "Rockchip thermal driver" 346 depends on ARCH_ROCKCHIP || COMPILE_TEST 347 depends on RESET_CONTROLLER 348 depends on HAS_IOMEM 349 help 350 Rockchip thermal driver provides support for Temperature sensor 351 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 352 trip point. Cpufreq is used as the cooling device and will throttle 353 CPUs when the Temperature crosses the passive trip point. 354 355config KIRKWOOD_THERMAL 356 tristate "Temperature sensor on Marvell Kirkwood SoCs" 357 depends on MACH_KIRKWOOD || COMPILE_TEST 358 depends on HAS_IOMEM 359 depends on OF 360 help 361 Support for the Kirkwood thermal sensor driver into the Linux thermal 362 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 363 364config DOVE_THERMAL 365 tristate "Temperature sensor on Marvell Dove SoCs" 366 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 367 depends on HAS_IOMEM 368 depends on OF 369 help 370 Support for the Dove thermal sensor driver in the Linux thermal 371 framework. 372 373config DB8500_THERMAL 374 tristate "DB8500 thermal management" 375 depends on MFD_DB8500_PRCMU && OF 376 default y 377 help 378 Adds DB8500 thermal management implementation according to the thermal 379 management framework. A thermal zone with several trip points will be 380 created. Cooling devices can be bound to the trip points to cool this 381 thermal zone if trip points reached. 382 383config ARMADA_THERMAL 384 tristate "Marvell EBU Armada SoCs thermal management" 385 depends on ARCH_MVEBU || COMPILE_TEST 386 depends on HAS_IOMEM 387 depends on OF 388 help 389 Enable this option if you want to have support for thermal management 390 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K). 391 392config DA9062_THERMAL 393 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver" 394 depends on MFD_DA9062 || COMPILE_TEST 395 depends on OF 396 help 397 Enable this for the Dialog Semiconductor thermal sensor driver. 398 This will report PMIC junction over-temperature for one thermal trip 399 zone. 400 Compatible with the DA9062 and DA9061 PMICs. 401 402menu "Mediatek thermal drivers" 403depends on ARCH_MEDIATEK || COMPILE_TEST 404source "drivers/thermal/mediatek/Kconfig" 405endmenu 406 407config AMLOGIC_THERMAL 408 tristate "Amlogic Thermal Support" 409 default ARCH_MESON 410 depends on OF && ARCH_MESON 411 help 412 If you say yes here you get support for Amlogic Thermal 413 for G12 SoC Family. 414 415 This driver can also be built as a module. If so, the module will 416 be called amlogic_thermal. 417 418menu "Intel thermal drivers" 419depends on X86 || X86_INTEL_QUARK || COMPILE_TEST 420source "drivers/thermal/intel/Kconfig" 421endmenu 422 423menu "Broadcom thermal drivers" 424depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \ 425 COMPILE_TEST 426source "drivers/thermal/broadcom/Kconfig" 427endmenu 428 429menu "Texas Instruments thermal drivers" 430depends on ARCH_HAS_BANDGAP || COMPILE_TEST 431depends on HAS_IOMEM 432source "drivers/thermal/ti-soc-thermal/Kconfig" 433endmenu 434 435menu "Samsung thermal drivers" 436depends on ARCH_EXYNOS || COMPILE_TEST 437source "drivers/thermal/samsung/Kconfig" 438endmenu 439 440menu "STMicroelectronics thermal drivers" 441depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF 442source "drivers/thermal/st/Kconfig" 443endmenu 444 445source "drivers/thermal/renesas/Kconfig" 446 447source "drivers/thermal/tegra/Kconfig" 448 449config GENERIC_ADC_THERMAL 450 tristate "Generic ADC based thermal sensor" 451 depends on IIO 452 help 453 This enabled a thermal sysfs driver for the temperature sensor 454 which is connected to the General Purpose ADC. The ADC channel 455 is read via IIO framework and the channel information is provided 456 to this driver. This driver reports the temperature by reading ADC 457 channel and converts it to temperature based on lookup table. 458 459menu "Qualcomm thermal drivers" 460depends on (ARCH_QCOM && OF) || COMPILE_TEST 461source "drivers/thermal/qcom/Kconfig" 462endmenu 463 464config UNIPHIER_THERMAL 465 tristate "Socionext UniPhier thermal driver" 466 depends on ARCH_UNIPHIER || COMPILE_TEST 467 depends on THERMAL_OF && MFD_SYSCON 468 help 469 Enable this to plug in UniPhier on-chip PVT thermal driver into the 470 thermal framework. The driver supports CPU thermal zone temperature 471 reporting and a couple of trip points. 472 473config SPRD_THERMAL 474 tristate "Temperature sensor on Spreadtrum SoCs" 475 depends on ARCH_SPRD || COMPILE_TEST 476 help 477 Support for the Spreadtrum thermal sensor driver in the Linux thermal 478 framework. 479 480config KHADAS_MCU_FAN_THERMAL 481 tristate "Khadas MCU controller FAN cooling support" 482 depends on OF 483 depends on MFD_KHADAS_MCU 484 select MFD_CORE 485 select REGMAP 486 help 487 If you say yes here you get support for the FAN controlled 488 by the Microcontroller found on the Khadas VIM boards. 489 490config LOONGSON2_THERMAL 491 tristate "Loongson-2 SoC series thermal driver" 492 depends on LOONGARCH || COMPILE_TEST 493 depends on OF 494 help 495 Support for Thermal driver found on Loongson-2 SoC series platforms. 496 The thermal driver realizes get_temp and set_trips function, which 497 are used to obtain the temperature of the current node and set the 498 temperature range to trigger the interrupt. When the input temperature 499 is higher than the high temperature threshold or lower than the low 500 temperature threshold, the interrupt will occur. 501 502endif 503