dt-bindings: interconnect: sm8650: document the MASTER_APSS_NOCDocument the MASTER_APSS_NOC interconnect node for the SM8650SoC system NoC.Signed-off-by: Neil Armstrong <neil.armstrong@linaro.or
dt-bindings: interconnect: sm8650: document the MASTER_APSS_NOCDocument the MASTER_APSS_NOC interconnect node for the SM8650SoC system NoC.Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>Acked-by: "Rob Herring (Arm)" <robh@kernel.org>Link: https://lore.kernel.org/r/20250415-topic-sm8650-upstream-icc-apss-noc-v1-1-9e6bea3943d8@linaro.orgSigned-off-by: Georgi Djakov <djakov@kernel.org>
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Merge tag 'soc-dt-6.14' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/socPull SoC devicetree updates from Arnd Bergmann: "We see the addition of eleven new SoCs, including a total of sixx
Merge tag 'soc-dt-6.14' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/socPull SoC devicetree updates from Arnd Bergmann: "We see the addition of eleven new SoCs, including a total of sixx arm64 chips from Qualcomm alone. Overall, the Qualcomm platforms once again make up the majority of all changes, after a couple of quieter releases. The new SoCs in this branch are: - Microchip sama7d65 is a new 32-bit embedded chip with a single Cortex-A7 and the current high end of the old Atmel SoC line. - Samsung Exynos 9810 is a mobile phone chip used in some older phones like the Samsung Galaxy S9 - Renesas R-Car V4H ES3.0 (R8A779G3) is an updated version of the V4H (R8A779G0) low-power automotive SoC - Renesas RZ/G3E (R0A09G047) is a family of embedded chips using Cortex-A55 cores - Qualcomm Snapdragon 8 Elite (SM8750) is a new phone chip based on Qualcomm's Oryon CPU cores. - Qualcomm Snapdragon AR2 (SAR2130P) is a SoC for augmented reality glasses. - Qualcomm IQ6 (QCS610) and IQ8 (QCS8300) are two industrial IOT platforms. - Snapdragon 425 (MSM8917) is a mobile phone SoC from 2016 - Qualcomm IPQ5424 is a Wi-Fi 7 networking chip All of the above are part of already supported SoC families that only need new devicetree files. Two additional SoCs in new families are part of a separate branch. There are 48 new machines in total, including six arm32 ones based on aspeed. broadcom, microchip and st SoCs all using Cortex-A7 cores, and a single risc-v board, the Banana Pi R3. The remaining ones use arm64 chips from Broadcom, Samsung, NXP, Mediatek, Qualcomm, Renesas and Rockchips and cover development boards, phones, laptops, industrial machines routers. A lot of ongoing work is for cleaning up build time warnings and other issues, in addition to the new machines and added features"* tag 'soc-dt-6.14' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (619 commits) arm64: tegra: Fix Tegra234 PCIe interrupt-map arm64: dts: qcom: x1e80100-romulus: Update firmware nodes arm64: dts: rockchip: add DTs for Firefly ITX-3588J and its Core-3588J SoM dt-bindings: arm: rockchip: Add Firefly ITX-3588J board arm64: dts: rockchip: Add Orange Pi 5 Max board dt-bindings: arm: rockchip: Add Xunlong Orange Pi 5 Max arm64: dts: rockchip: refactor common rk3588-orangepi-5.dtsi arm64: dts: rockchip: add WLAN to rk3588-evb1 controller arm64: dts: rockchip: increase gmac rx_delay on rk3399-puma arm64: dts: rockchip: Delete redundant RK3328 GMAC stability fixes arm64: tegra: Disable Tegra234 sce-fabric node arm64: tegra: Fix typo in Tegra234 dce-fabric compatible arm64: tegra: Fix DMA ID for SPI2 arm64: dts: qcom: msm8916-samsung-serranove: Add display panel arm64: dts: qcom: sm8650: Add 'global' interrupt to the PCIe RC nodes arm64: dts: qcom: sm8550: Add 'global' interrupt to the PCIe RC nodes arm64: dts: qcom: Remove unused and undocumented properties arm64: dts: qcom: sdm450-lenovo-tbx605f: add DSI panel nodes arm64: dts: qcom: pmi8950: add LAB-IBB nodes arm64: dts: qcom: ipq5424: enable the download mode support ...
dt-bindings: interconnect: Add Qualcomm IPQ5424 supportAdd master/slave ids for Qualcomm IPQ5424 Network-On-Chipinterfaces. This will be used by the gcc-ipq5424 driverfor providing interconnect s
dt-bindings: interconnect: Add Qualcomm IPQ5424 supportAdd master/slave ids for Qualcomm IPQ5424 Network-On-Chipinterfaces. This will be used by the gcc-ipq5424 driverfor providing interconnect services using the icc-clk framework.Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Link: https://lore.kernel.org/r/20241213105808.674620-1-quic_varada@quicinc.comSigned-off-by: Bjorn Andersson <andersson@kernel.org>
dt-bindings: interconnect: add interconnect bindings for SM8750Add interconnect device bindings. These devices can be usedto describe any RPMh and NoC based interconnect devices.Signed-off-by: R
dt-bindings: interconnect: add interconnect bindings for SM8750Add interconnect device bindings. These devices can be usedto describe any RPMh and NoC based interconnect devices.Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>Signed-off-by: Melody Olvera <quic_molvera@quicinc.com>Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-1-3d9aad4200e9@quicinc.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
Merge branch 'icc-sar2130p' into icc-nextAdd driver for the network of connects present on the SAR2130P platform.* icc-sar2130p dt-bindings: interconnect: qcom: document SAR2130P NoC intercon
Merge branch 'icc-sar2130p' into icc-nextAdd driver for the network of connects present on the SAR2130P platform.* icc-sar2130p dt-bindings: interconnect: qcom: document SAR2130P NoC interconnect: qcom: add support for SAR2130PLink: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-0-c58c73dcd19d@linaro.orgSigned-off-by: Georgi Djakov <djakov@kernel.org>
Merge branch 'icc-qcs615' into icc-nextAdd interconnect dt-bindings and driver support for Qualcomm QCS615 SoC.* icc-qcs615 dt-bindings: interconnect: document the RPMh Network-On-Chip intercon
Merge branch 'icc-qcs615' into icc-nextAdd interconnect dt-bindings and driver support for Qualcomm QCS615 SoC.* icc-qcs615 dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoC interconnect: qcom: add QCS615 interconnect provider driverLink: https://lore.kernel.org/r/20240924143958.25-1-quic_rlaggysh@quicinc.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: qcom: document SAR2130P NoCAdd bindings for the Network of Connects (NoC) present on theQualcomm SAR2130P platform.Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowsk
dt-bindings: interconnect: qcom: document SAR2130P NoCAdd bindings for the Network of Connects (NoC) present on theQualcomm SAR2130P platform.Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-1-c58c73dcd19d@linaro.orgSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoCDocument the RPMh Network-On-Chip Interconnect of the QCS615 platform.Signed-off-by: Raviteja Laggyshetty <q
dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoCDocument the RPMh Network-On-Chip Interconnect of the QCS615 platform.Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>Link: https://lore.kernel.org/r/20240924143958.25-2-quic_rlaggysh@quicinc.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS8300 SoCDocument the RPMh Network-On-Chip Interconnect of the QCS8300 platform.Reviewed-by: Krzysztof Kozlowski <kr
dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS8300 SoCDocument the RPMh Network-On-Chip Interconnect of the QCS8300 platform.Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>Link: https://lore.kernel.org/r/20240910101013.3020-2-quic_rlaggysh@quicinc.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
Merge tag 'char-misc-6.12-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-miscPull char / misc driver updates from Greg KH: "Here is the "big" set of char/misc and other driver s
Merge tag 'char-misc-6.12-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-miscPull char / misc driver updates from Greg KH: "Here is the "big" set of char/misc and other driver subsystem changes for 6.12-rc1. Lots of changes in here, primarily dominated by the usual IIO driver updates and additions, but there are also small driver subsystem updates all over the place. Included in here are: - lots and lots of new IIO drivers and updates to existing ones - interconnect subsystem updates and new drivers - nvmem subsystem updates and new drivers - mhi driver updates - power supply subsystem updates - kobj_type const work for many different small subsystems - comedi driver fix - coresight subsystem and driver updates - fpga subsystem improvements - slimbus fixups - binder new feature addition for "frozen" notifications - lots and lots of other small driver updates and cleanups All of these have been in linux-next for a long time with no reported problems"* tag 'char-misc-6.12-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (354 commits) greybus: gb-beagleplay: Add firmware upload API arm64: dts: ti: k3-am625-beagleplay: Add bootloader-backdoor-gpios to cc1352p7 dt-bindings: net: ti,cc1352p7: Add bootloader-backdoor-gpios MAINTAINERS: Update path for U-Boot environment variables YAML nvmem: layouts: add U-Boot env layout comedi: ni_routing: tools: Check when the file could not be opened ocxl: Remove the unused declarations in headr file hpet: Fix the wrong format specifier uio: Constify struct kobj_type cxl: Constify struct kobj_type binder: modify the comment for binder_proc_unlock iio: adc: axp20x_adc: add support for AXP717 ADC dt-bindings: iio: adc: Add AXP717 compatible iio: adc: axp20x_adc: Add adc_en1 and adc_en2 to axp_data w1: ds2482: Drop explicit initialization of struct i2c_device_id::driver_data to 0 tools: iio: rm .*.cmd when make clean iio: adc: standardize on formatting for id match tables iio: proximity: aw96103: Add support for aw96103/aw96105 proximity sensor bus: mhi: host: pci_generic: Enable EDL trigger for Foxconn modems bus: mhi: host: pci_generic: Update EDL firmware path for Foxconn modems ...
Merge branch 'icc-sm8350' into icc-nextA set of fixes that target stability of the SM8350 platform.* icc-sm8350 interconnect: qcom: sm8350: drop DISP nodes dt-bindings: interconnect: qcom,sm8
Merge branch 'icc-sm8350' into icc-nextA set of fixes that target stability of the SM8350 platform.* icc-sm8350 interconnect: qcom: sm8350: drop DISP nodes dt-bindings: interconnect: qcom,sm8350: drop DISP nodes interconnect: qcom: sm8250: Enable sync_stateLink: https://lore.kernel.org/r/20240804-sm8350-fixes-v1-0-1149dd8399fe@linaro.org/Signed-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: qcom,sm8350: drop DISP nodesVendor msm-5.x kernels declared duplicate indices for some of displaynodes to be used by separate display RSC and BCM voters. As it is notcl
dt-bindings: interconnect: qcom,sm8350: drop DISP nodesVendor msm-5.x kernels declared duplicate indices for some of displaynodes to be used by separate display RSC and BCM voters. As it is notclear how this separate BCM should be modelled upstream and the devicetrees do not use these indices, drop them for now.Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Link: https://lore.kernel.org/r/20240804-sm8350-fixes-v1-6-1149dd8399fe@linaro.orgSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoCAdd bindings for Qualcomm MSM8937 Network-On-Chip interconnect devices.Signed-off-by: Adam Skladowski <a39.skl@gmail.com>Reviewed-by: Rob
dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoCAdd bindings for Qualcomm MSM8937 Network-On-Chip interconnect devices.Signed-off-by: Adam Skladowski <a39.skl@gmail.com>Reviewed-by: Rob Herring (Arm) <robh@kernel.org>Link: https://lore.kernel.org/r/20240709102728.15349-4-a39.skl@gmail.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoCAdd bindings for Qualcomm MSM8976 Network-On-Chip interconnect devices.Signed-off-by: Adam Skladowski <a39.skl@gmail.com>Reviewed-by: Rob
dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoCAdd bindings for Qualcomm MSM8976 Network-On-Chip interconnect devices.Signed-off-by: Adam Skladowski <a39.skl@gmail.com>Reviewed-by: Rob Herring (Arm) <robh@kernel.org>Link: https://lore.kernel.org/r/20240709102728.15349-2-a39.skl@gmail.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Add Qualcomm IPQ5332 supportAdd interconnect-cells to clock provider so that it can beused as icc provider.Add master/slave ids for Qualcomm IPQ5332 Network-On-Chipin
dt-bindings: interconnect: Add Qualcomm IPQ5332 supportAdd interconnect-cells to clock provider so that it can beused as icc provider.Add master/slave ids for Qualcomm IPQ5332 Network-On-Chipinterfaces. This will be used by the gcc-ipq5332 driverfor providing interconnect services using the icc-clkframework.Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>Link: https://lore.kernel.org/r/20240730054817.1915652-2-quic_varada@quicinc.comSigned-off-by: Bjorn Andersson <andersson@kernel.org>
Merge tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-miscPull char / misc and other driver updates from Greg KH: "Here is the "big" set of char/misc and othe
Merge tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-miscPull char / misc and other driver updates from Greg KH: "Here is the "big" set of char/misc and other driver subsystem changes for 6.11-rc1. Nothing major in here, just loads of new drivers and updates. Included in here are: - IIO api updates and new drivers added - wait_interruptable_timeout() api cleanups for some drivers - MODULE_DESCRIPTION() additions for loads of drivers - parport out-of-bounds fix - interconnect driver updates and additions - mhi driver updates and additions - w1 driver fixes - binder speedups and fixes - eeprom driver updates - coresight driver updates - counter driver update - new misc driver additions - other minor api updates All of these, EXCEPT for the final Kconfig build fix for 32bit systems, have been in linux-next for a while with no reported issues. The Kconfig fixup went in 29 hours ago, so might have missed the latest linux-next, but was acked by everyone involved"* tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (330 commits) misc: Kconfig: exclude mrvl-cn10k-dpi compilation for 32-bit systems misc: delete Makefile.rej binder: fix hang of unregistered readers misc: Kconfig: add a new dependency for MARVELL_CN10K_DPI virtio: add missing MODULE_DESCRIPTION() macro agp: uninorth: add missing MODULE_DESCRIPTION() macro spmi: add missing MODULE_DESCRIPTION() macros dev/parport: fix the array out-of-bounds risk samples: configfs: add missing MODULE_DESCRIPTION() macro misc: mrvl-cn10k-dpi: add Octeon CN10K DPI administrative driver misc: keba: Fix missing AUXILIARY_BUS dependency slimbus: Fix struct and documentation alignment in stream.c MAINTAINERS: CC dri-devel list on Qualcomm FastRPC patches misc: fastrpc: use coherent pool for untranslated Compute Banks misc: fastrpc: support complete DMA pool access to the DSP misc: fastrpc: add missing MODULE_DESCRIPTION() macro misc: fastrpc: Add missing dev_err newlines misc: fastrpc: Use memdup_user() nvmem: core: Implement force_ro sysfs attribute nvmem: Use sysfs_emit() for type attribute ...
dt-bindings: interconnect: Add Qualcomm IPQ9574 supportAdd interconnect-cells to clock provider so that it can beused as icc provider.Add master/slave ids for Qualcomm IPQ9574 Network-On-Chipin
dt-bindings: interconnect: Add Qualcomm IPQ9574 supportAdd interconnect-cells to clock provider so that it can beused as icc provider.Add master/slave ids for Qualcomm IPQ9574 Network-On-Chipinterfaces. This will be used by the gcc-ipq9574 driverthat will for providing interconnect services using theicc-clk framework.Acked-by: Georgi Djakov <djakov@kernel.org>Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>Link: https://lore.kernel.org/r/20240430064214.2030013-3-quic_varada@quicinc.comSigned-off-by: Bjorn Andersson <andersson@kernel.org>
Merge branch 'icc-msm8953' into icc-nextAdd interconnect driver for MSM8953-based devices.* icc-msm8953 dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC interconnect: qcom: Add MSM89
Merge branch 'icc-msm8953' into icc-nextAdd interconnect driver for MSM8953-based devices.* icc-msm8953 dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC interconnect: qcom: Add MSM8953 driverLink: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-0-a70d582182dc@mainlining.orgSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoCAdd the device-tree bindings for interconnect providersused on MSM8953 platform.Signed-off-by: Vladimir Lypak <vladimir.lypak@gmail.com>
dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoCAdd the device-tree bindings for interconnect providersused on MSM8953 platform.Signed-off-by: Vladimir Lypak <vladimir.lypak@gmail.com>Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-1-a70d582182dc@mainlining.orgSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Add MediaTek EMI Interconnect bindingsAdd bindings for the MediaTek External Memory Interface Interconnect,which providers support system bandwidth requirements through
dt-bindings: interconnect: Add MediaTek EMI Interconnect bindingsAdd bindings for the MediaTek External Memory Interface Interconnect,which providers support system bandwidth requirements through DynamicVoltage Frequency Scaling Resource Collector (DVFSRC) hardware.This adds bindings for MediaTek MT8183 and MT8195 SoCs.Note that this is modeled as a subnode of DVFSRC for multiple reasons: - Some SoCs have more than one interconnect on the DVFSRC (and two different kinds of EMI interconnect, and also a SMI interconnect); - Some boards will want to not enable the interconnect driver because some of those are not battery powered (so they just keep the knobs at full thrust from the bootloader and never care scaling busses); - Some DVFSRC interconnect features may depend on firmware.Reviewed-by: Rob Herring <robh@kernel.org>Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>Link: https://lore.kernel.org/r/20240610085735.147134-3-angelogioacchino.delregno@collabora.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
Merge branch 'icc-sm7150' into icc-nextAdd dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC.* icc-sm7150 dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings inte
Merge branch 'icc-sm7150' into icc-nextAdd dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC.* icc-sm7150 dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings interconnect: qcom: Add SM7150 driver supportLink: https://lore.kernel.org/r/20240222174250.80493-1-danila@jiaxyga.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Add Qualcomm SM7150 DT bindingsThe Qualcomm SM7150 platform has several bus fabrics that could becontrolled and tuned dynamically according to the bandwidth demand.Sig
dt-bindings: interconnect: Add Qualcomm SM7150 DT bindingsThe Qualcomm SM7150 platform has several bus fabrics that could becontrolled and tuned dynamically according to the bandwidth demand.Signed-off-by: Danila Tikhonov <danila@jiaxyga.com>Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Link: https://lore.kernel.org/r/20240222174250.80493-2-danila@jiaxyga.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
Merge branch 'icc-cleanup' into icc-next* icc-cleanup interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes dt-bindings: interconnect: Remove bogus interconnect nodes interconnect:
Merge branch 'icc-cleanup' into icc-next* icc-cleanup interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes dt-bindings: interconnect: Remove bogus interconnect nodes interconnect: qcom: x1e80100: Remove bogus per-RSC BCMs and nodes interconnect: qcom: sa8775p: constify pointer to qcom_icc_node interconnect: qcom: sm8250: constify pointer to qcom_icc_node interconnect: qcom: sm6115: constify pointer to qcom_icc_node interconnect: qcom: sa8775p: constify pointer to qcom_icc_bcm interconnect: qcom: x1e80100: constify pointer to qcom_icc_bcm dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address interconnect: constify of_phandle_args in xlateSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Remove bogus interconnect nodesThe downstream kernel has infrastructure for passing votes from differentinterconnect nodes onto different RPMh RSCs. This neither impleme
dt-bindings: interconnect: Remove bogus interconnect nodesThe downstream kernel has infrastructure for passing votes from differentinterconnect nodes onto different RPMh RSCs. This neither implemented, notis going to be implemented upstream (in favor of a different solutionusing ICC tags through the same node).Unfortunately, as it happens, meaningless (in the upstream context) partsof the vendor driver were copied, ending up causing havoc - since all"per-RSC" (in quotes because they all point to the main APPS one) BCMsdefined within the driver overwrite the value in RPMh on everyaggregation.To both avoid keeping bogus code around and possibly introducingimpossible-to-track-down bugs (busses shutting down for no reason), getrid of the duplicated ICC node definitions.Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Link: https://lore.kernel.org/r/20240102-topic-x1e_fixes-v1-2-70723e08d5f6@linaro.orgSigned-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindingsAdd bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices.[Stephan: Drop separate mm-snoc that exists downstream since it's
dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindingsAdd bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices.[Stephan: Drop separate mm-snoc that exists downstream since it's actually the same NoC as SNoC in hardware]Signed-off-by: Adam Skladowski <a39.skl@gmail.com>Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-1-3b68bbed2891@kernkonzept.comSigned-off-by: Georgi Djakov <djakov@kernel.org>
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