Merge tag 'asoc-fix-v6.19-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/broonie/sound into for-linus

ASoC: Fixes for v6.19

We've been quite busy with fixes since the merge window, though

Merge tag 'asoc-fix-v6.19-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/broonie/sound into for-linus

ASoC: Fixes for v6.19

We've been quite busy with fixes since the merge window, though not in
any particularly exciting ways - the standout thing is the fix for _SX
controls which were broken by a change to how we do clamping, otherwise
it's all fairly run of the mill fixes and quirks.

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Merge remote-tracking branch 'drm/drm-fixes' into drm-misc-fixes

Pull in rc1 to include all changes since the merge window closed,
and grab all fixes and changes from drm/drm-next.

Signed-off-by: M

Merge remote-tracking branch 'drm/drm-fixes' into drm-misc-fixes

Pull in rc1 to include all changes since the merge window closed,
and grab all fixes and changes from drm/drm-next.

Signed-off-by: Maarten Lankhorst <dev@lankhorst.se>

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Merge tag 'soc-dt-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc

Pull SoC devicetree updates from Arnd Bergmann:
"Three new SoCs got added in existing arm64 chip families:

- Ren

Merge tag 'soc-dt-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc

Pull SoC devicetree updates from Arnd Bergmann:
"Three new SoCs got added in existing arm64 chip families:

- Renesas R-Car X5H (R8A78000) is a new generation of automotive
SoCs, based on 16 Cortex-A720 (Armv9.2) cores, which makes the the
currently highest-perforance embedded SoC.

- TI AM62L is a new variant of the AM62 family of industrial SoCs,
this one comes without a GPU.

- Qualcomm MSM8937 (Snapdragon 430) is an older mobile phone chip
based on Cortex-A53, and closely related to MSM8917 (Snapdragn
425), which we already support.

In addition, there are a good number of newly supported machines
across SoC families:

- Two Aspeed AST2600 (Cortex-A7) based BMC setups for large servers

- Mobile Phones and tables based on Mediatek MT6582, Nvidia Tegra124,
Qualcomm MSM8937 and Qualcomm MSM8939,

- Two Laptops based on Qualcomm SoCs: one using the older sdm850, the
other using x1p42100.

- One Router based on Rockchips RK3568

- 24 variants of the Enclustra Mercury system-on-module, all based on
32-bit Intel/Altera SocFPGA chips, plus two boards using 64-bit
SocFPGA Agilex chips..

- 30 industrial/embedded boards and single-board computers, using
various chips from NXP, Rockchips, Mediatek, TI, Amlogic, Qualcomm,
Spacemit, and Starfive.

In total there are 783 commits here, the majority of these improving
hardware support and cleaning up devicetree files across the tree,
with the majority of the changes going into the Qualcomm, NXP, Renesas
and Rockchips platforms"

* tag 'soc-dt-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (782 commits)
arm64: dts: mediatek: mt8195: Fix address range for JPEG decoder core 1
ARM: dts: samsung: exynos4412-midas: turn off SDIO WLAN chip during system suspend
ARM: dts: samsung: exynos4210-trats: turn off SDIO WLAN chip during system suspend
ARM: dts: samsung: exynos4210-i9100: turn off SDIO WLAN chip during system suspend
ARM: dts: samsung: universal_c210: turn off SDIO WLAN chip during system suspend
arm64: dts: amlogic: meson-g12b: Fix L2 cache reference for S922X CPUs
arm64: dts: Add gpio_intc node for Amlogic S7D SoCs
arm64: dts: Add gpio_intc node for Amlogic S7 SoCs
arm64: dts: Add gpio_intc node for Amlogic S6 SoCs
arm64: dts: amlogic: s7d: add ao secure node
arm64: dts: amlogic: s7: add ao secure node
arm64: dts: amlogic: s6: add ao secure node
arm64: dts: amlogic: Fix the register name of the 'DBI' region
dts: arm64: amlogic: add a5 pinctrl node
arm64: dts: amlogic: s7d: add power domain controller node
arm64: dts: amlogic: s7: add power domain controller node
arm64: dts: amlogic: s6: add power domain controller node
dts: arm64: amlogic: Add ISP related nodes for C3
arm64: dts: meson: add initial device-tree for Tanix TX9 Pro
dt-bindings: arm: amlogic: add support for Tanix TX9 Pro
...

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Merge tag 'aspeed-6.19-devicetree-0' of https://git.kernel.org/pub/scm/linux/kernel/git/bmc/linux into soc/dt

First batch of ASPEED Arm devicetree changes for 6.19

Significant changes:

- The IBM P

Merge tag 'aspeed-6.19-devicetree-0' of https://git.kernel.org/pub/scm/linux/kernel/git/bmc/linux into soc/dt

First batch of ASPEED Arm devicetree changes for 6.19

Significant changes:

- The IBM Power11 FSI DTSIs have been rearranged to accommodate new systems

New platforms:

- IBM Balcones

The Balcones system is similar to Bonnell but with a POWER11 processor.
Like POWER10, the POWER11 is a dual-chip module, so a dual chip FSI
tree is needed.

- Meta Yosemite5

The Yosemite5 platform provides monitoring of voltages, power,
temperatures, and other critical parameters across the motherboard,
CXL board, E1.S expansion board, and NIC components.

Updated platforms:

- clemente (Meta): LEDs, shunt resistor configuration
- santabarbara (Meta): AMD APML, EEPROMs, LEDs, GPIO line names, MCTP for NICs

There are a scattering of one-off changes and devicetree cleanups for other
platforms as well.

* tag 'aspeed-6.19-devicetree-0' of https://git.kernel.org/pub/scm/linux/kernel/git/bmc/linux:
ARM: dts: aspeed: santabarbara: Add eeprom device node for PRoT module
ARM: dts: aspeed: santabarbara: Add AMD APML interface support
ARM: dts: aspeed: santabarbara: Add gpio line name
ARM: dts: aspeed: santabarbara: Add bmc_ready_noled Led
ARM: dts: aspeed: santabarbara: Enable MCTP for frontend NIC
ARM: dts: aspeed: santabarbara: Add sensor support for extension boards
ARM: dts: aspeed: santabarbara: Add blank lines between nodes for readability
ARM: dts: aspeed: yosemite5: Add Meta Yosemite5 BMC
dt-bindings: arm: aspeed: add Meta Yosemite5 board
ARM: dts: aspeed: clemente: Add HDD LED GPIO
ARM: dts: aspeed: Fix max31785 fan properties
ARM: dts: aspeed: Add Balcones system
dt-bindings: arm: aspeed: add IBM Bonnell board
dt-bindings: arm: aspeed: add IBM Balcones board
ARM: dts: aspeed: harma: Add MCTP I2C controller node
ARM: dts: aspeed: yosemite4: allocate ramoops for kernel panic
ARM: dts: aspeed: clemente: add shunt-resistor-micro-ohms for LM5066i

Signed-off-by: Arnd Bergmann <arnd@arndb.de>

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ARM: dts: aspeed: yosemite5: Add Meta Yosemite5 BMC

Add device tree for the Meta (Facebook) Yosemite5 compute node,
based on the AST2600 BMC.

The Yosemite5 platform provides monitoring of voltages,

ARM: dts: aspeed: yosemite5: Add Meta Yosemite5 BMC

Add device tree for the Meta (Facebook) Yosemite5 compute node,
based on the AST2600 BMC.

The Yosemite5 platform provides monitoring of voltages, power,
temperatures, and other critical parameters across the motherboard,
CXL board, E1.S expansion board, and NIC components. The BMC also
logs relevant events and performs appropriate system actions in
response to abnormal conditions.

Signed-off-by: Kevin Tung <kevin.tung.openbmc@gmail.com>
Signed-off-by: Andrew Jeffery <andrew@codeconstruct.com.au>

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ARM: dts: aspeed: Add Balcones system

The Balcones system is similar to Bonnell but with a POWER11 processor.
Like POWER10, the POWER11 is a dual-chip module, so a dual chip FSI
tree is needed. Ther

ARM: dts: aspeed: Add Balcones system

The Balcones system is similar to Bonnell but with a POWER11 processor.
Like POWER10, the POWER11 is a dual-chip module, so a dual chip FSI
tree is needed. Therefore, split up the quad chip FSI tree.

Signed-off-by: Eddie James <eajames@linux.ibm.com>
Signed-off-by: Andrew Jeffery <andrew@codeconstruct.com.au>

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Merge remote-tracking branch 'drm/drm-next' into msm-next-robclark

Back-merge drm-next to get caught up.

Signed-off-by: Rob Clark <robin.clark@oss.qualcomm.com>

Merge drm/drm-next into drm-xe-next

Backmerging to bring in 6.18-rc1.

Signed-off-by: Thomas Hellström <thomas.hellstrom@linux.intel.com>

Merge drm/drm-next into drm-intel-next

Sync to v6.18-rc1.

Signed-off-by: Jani Nikula <jani.nikula@intel.com>

Merge drm/drm-next into drm-misc-next

Updating drm-misc-next to the state of v6.18-rc1.

Signed-off-by: Thomas Zimmermann <tzimmermann@suse.de>

Merge drm/drm-next into drm-intel-gt-next

Backmerge in order to get the commit:

048832a3f400 ("drm/i915: Refactor shmem_pwrite() to use kiocb and write_iter")

To drm-intel-gt-next as there are f

Merge drm/drm-next into drm-intel-gt-next

Backmerge in order to get the commit:

048832a3f400 ("drm/i915: Refactor shmem_pwrite() to use kiocb and write_iter")

To drm-intel-gt-next as there are followup fixes to be applied.

Signed-off-by: Joonas Lahtinen <joonas.lahtinen@linux.intel.com>

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Merge branch 'objtool/core'

Bring in the UDB and objtool data annotations to avoid conflicts while further extending the bug exceptions.

Signed-off-by: Peter Zijlstra <peterz@infradead.org>

Merge commit 'linus' into core/bugs, to resolve conflicts

Resolve conflicts with this commit that was developed in parallel
during the merge window:

8c8efa93db68 ("x86/bug: Add ARCH_WARN_ASM macro

Merge commit 'linus' into core/bugs, to resolve conflicts

Resolve conflicts with this commit that was developed in parallel
during the merge window:

8c8efa93db68 ("x86/bug: Add ARCH_WARN_ASM macro for BUG/WARN asm code sharing with Rust")

Conflicts:
arch/riscv/include/asm/bug.h
arch/x86/include/asm/bug.h

Signed-off-by: Ingo Molnar <mingo@kernel.org>

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Merge tag 'v6.18-rc6' into for-linus

Sync up with the mainline to bring in definition of
INPUT_PROP_HAPTIC_TOUCHPAD.

spi: Merge up v6.18-rc1

Ensure my CI has a sensible baseline.

Merge tag 'asoc-fix-v6.18-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/broonie/sound into for-linus

ASoC: Fixes for v6.18

A moderately large collection of driver specific fixes, plus a f

Merge tag 'asoc-fix-v6.18-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/broonie/sound into for-linus

ASoC: Fixes for v6.18

A moderately large collection of driver specific fixes, plus a few new
quirks and device IDs. The NAU8821 changes are a little large but more
in mechanical ways than in ways that are complex.

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Merge drm/drm-fixes into drm-misc-fixes

Updating drm-misc-fixes to the state of v6.18-rc1.

Signed-off-by: Thomas Zimmermann <tzimmermann@suse.de>

Merge branch 'next' into for-linus

Prepare input updates for 6.18 merge window.

Merge tag 'v6.17-rc2' into HEAD

Sync up with mainline to bring in changes to include/linux/sprintf.h

Merge drm/drm-next into drm-misc-next-fixes

Backmerging to drm-misc-next-fixes to get features and fixes from
v6.17-rc6.

Signed-off-by: Thomas Zimmermann <tzimmermann@suse.de>

Merge drm/drm-next into drm-intel-next

Catching up with some display dependencies.

Signed-off-by: Rodrigo Vivi <rodrigo.vivi@intel.com>

Merge drm/drm-next into drm-xe-next

Bring v6.17-rc1 to propagate commits from other subsystems, particularly
PCI, which has some new functions needed for SR-IOV integration.

Signed-off-by: Lucas De

Merge drm/drm-next into drm-xe-next

Bring v6.17-rc1 to propagate commits from other subsystems, particularly
PCI, which has some new functions needed for SR-IOV integration.

Signed-off-by: Lucas De Marchi <lucas.demarchi@intel.com>

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Merge drm/drm-next into drm-misc-n

Updating drm-misc-next to the state of v6.17-rc1. Begins a new release
cycle.

Signed-off-by: Thomas Zimmermann <tzimmermann@suse.de>

Merge tag 'soc-dt-6.18' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc

Pull SoC dt updates from Arnd Bergmann:
"There are five sets of new SoCs that get added in existing families,
all

Merge tag 'soc-dt-6.18' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc

Pull SoC dt updates from Arnd Bergmann:
"There are five sets of new SoCs that get added in existing families,
all of them being either upgrades or cut-down versions of the older
chips:

- Apple M2 Pro, M2 Max and M2 Ultra, used in the 2022/2023 generation
of high-end workstations and laptops from Apple. Linux has been
working on these for a while but stil requires patches.

- Axis Artpec8 is an Armv8 chip based on Samsung Exynos design,
unlike the earlier Armv7 Artpec6 from the same company that was
part of a separate family of chips.

- NXP i.MX91 is a cut-down version of i.MX93, using only a single
Cortex-A55 core.

- Qualcomm Lemans Auto is a variant of the Lemans SoC that was
originally merged under the sa8775p name, the differences being
mostly the firmware configuration of the platform.

- Four new Renesas SoCs RZ/T2H (r9a09g077m44), RZ/N2H (r9a09g087m44),
RZ/T2H (r9a09g077), and RZ/N2H (r9a09g087) are all industrial
bedded SoCs based on Cortex-A55 cores

In total, there are 65 new machines, including:

- Industrial embedded system and single-board computers based on NXP,
Allwinner, TI, Rockchips, Marvell, Xilinx Spacemit, Starfive chips.

- Reference boards for the newly added Renesas, Qualcomm, NXP and
Axis ARMv8 chips as well as Microchip's MPFS RISC-V SoC

- Laptops and Workstations using Apple M2 and Qualcomm Snapdragon X1
chips.

- Several Samsung phones using Qualcomm Snapdragon chips

- Set-top boxes based on Allwinner H313

- Five BMC boards using 32-bit ASpeed SoCs

- Three network routers using IXP4xx (ARMv5!) and Broadcom bcm4708
(ARMv7) SoCs

Two machines get phased out because they were available only in small
quantities but never made it into products: one STi407 based reference
board, and a Snapdragon 845 based Chromebook.

Aside from the newly added machines, a lot of work went into improving
hardware support on the existing machines and cleaning up contents for
validation"

* tag 'soc-dt-6.18' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (931 commits)
arm64: dts: apm-shadowcat: Drop "apm,xgene2-pcie" compatible
arm64: dts: apm-shadowcat: Move slimpro nodes out of "simple-bus" node
ARM: dts: microchip: sam9x7: Add qspi controller
arm64: dts: qcom: Add MST pixel streams for displayport
arm64: dts: qcom: sm6350: correct DP compatibility strings
arm64: dts: qcom: monaco-evk: Enable Adreno 623 GPU
arm64: dts: qcom: qcs8300-ride: Enable Adreno 623 GPU
arm64: dts: qcom: qcs8300: Add gpu and gmu nodes
arm64: dts: allwinner: h313: Add Amediatech X96Q
dt-bindings: arm: sunxi: Add Amediatech X96Q
arm64: dts: apple: t8015: Add SPMI node
arm64: dts: apple: t8012: Add SPMI node
arm64: dts: apple: Add J180d (Mac Pro, M2 Ultra, 2023) device tree
arm64: dts: rockchip: Add devicetree for the ROC-RK3588-RT
dt-bindings: arm: rockchip: Add Firefly ROC-RK3588-RT
arm64: dts: rockchip: update pinctrl names for Radxa E52C
arm64: dts: rockchip: remove vcc_3v3_pmu regulator for Radxa E52C
arm64: dts: apple: Add J474s, J475c and J475d device trees
arm64: dts: apple: Add J414 and J416 Macbook Pro device trees
arm64: dts: apple: Add initial t6020/t6021/t6022 DTs
...

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Merge tag 'aspeed-6.18-devicetree-1' of https://git.kernel.org/pub/scm/linux/kernel/git/bmc/linux into soc/dt

Further ASPEED devicetree updates for v6.18

New platforms:

- Meta Clemente

Clemente

Merge tag 'aspeed-6.18-devicetree-1' of https://git.kernel.org/pub/scm/linux/kernel/git/bmc/linux into soc/dt

Further ASPEED devicetree updates for v6.18

New platforms:

- Meta Clemente

Clemente is a compute-tray platform using an AST2600 SoC

Updated platforms:

- Harma (Meta): Hot-swap controller, power monitoring, GPIO names

There are also some devicetree cleanups from Rob and Krzysztof that touch a
variety of platforms and the DTSIs. These lead to fewer warnings emitted for the
ASPEED devicetrees.

* tag 'aspeed-6.18-devicetree-1' of https://git.kernel.org/pub/scm/linux/kernel/git/bmc/linux:
ARM: dts: aspeed: Drop syscon "reg-io-width" properties
ARM: dts: aspeed: Drop "sdhci" compatibles
ARM: dts: aspeed: Fix/add I2C device vendor prefixes
ARM: dts: aspeed: Minor whitespace cleanup
ARM: dts: aspeed: clemente: add Meta Clemente BMC
ARM: dts: aspeed: Add NCSI3 and NCSI4 pinctrl nodes
dt-bindings: arm: aspeed: add Meta Clemente board
ARM: dts: aspeed: harma: add mp5990
ARM: dts: aspeed: harma: revise gpio name
ARM: dts: aspeed: harma: add power monitor support

Link: https://lore.kernel.org/r/5793039afcedeb28179a3c9909631d8251abc73e.camel@codeconstruct.com.au
Signed-off-by: Arnd Bergmann <arnd@arndb.de>

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