Merge branch 'next' into for-linus

Prepare input updates for 6.11 merge window.

Merge tag 'v6.9' into next

Sync up with the mainline to bring in the new cleanup API.

Merge drm/drm-next into drm-intel-gt-next

Some display refactoring patches are needed in order to allow conflict-
less merging.

Signed-off-by: Tvrtko Ursulin <tursulin@ursulin.net>

Merge drm/drm-next into drm-intel-next

Backmerge to bring Xe driver to drm-intel-next.

Signed-off-by: Jani Nikula <jani.nikula@intel.com>

Merge tag 'v6.8-rc4' into x86/percpu, to resolve conflicts and refresh the branch

Conflicts:
arch/x86/include/asm/percpu.h
arch/x86/include/asm/text-patching.h

Signed-off-by: Ingo Molnar <mingo@k

Merge tag 'v6.8-rc4' into x86/percpu, to resolve conflicts and refresh the branch

Conflicts:
arch/x86/include/asm/percpu.h
arch/x86/include/asm/text-patching.h

Signed-off-by: Ingo Molnar <mingo@kernel.org>

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Merge remote-tracking branch 'torvalds/master' into perf-tools-next

To pick up fixes that went thru perf-tools for v6.7 and to get in sync
with upstream to check for drift in the copies of headers,

Merge remote-tracking branch 'torvalds/master' into perf-tools-next

To pick up fixes that went thru perf-tools for v6.7 and to get in sync
with upstream to check for drift in the copies of headers, etc.

Signed-off-by: Arnaldo Carvalho de Melo <acme@redhat.com>

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Merge drm/drm-next into drm-misc-next

Let's kickstart the v6.8 release cycle.

Signed-off-by: Maxime Ripard <mripard@kernel.org>

Merge branch 'tip/perf/urgent'

Avoid conflicts, base on fixes.

Signed-off-by: Peter Zijlstra <peterz@infradead.org>

Merge tag 'thermal-6.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull thermal control updates from Rafael Wysocki:
"These further rework the ACPI thermal driver, after t

Merge tag 'thermal-6.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull thermal control updates from Rafael Wysocki:
"These further rework the ACPI thermal driver, after the changes made
to it in the previous cycle, to make it easier to grasp, get rid of
redundant pieces of internal data structures and eliminate its
reliance on a specific ordering of trip point objects in the thermal
core, make thermal core adjustments needed for the ACPI thermal driver
rework, modify the thermal governor interface so as to use trip
pointers for representing trip points in it, switch over multiple
thermal drivers to using void platform driver remove callbacks, add
support for 2 hardware features to the Intel int340x thermal driver,
add support for new hardware on ARM platforms, update documentation,
fix problems, clean up code and update the MAINTAINERS record for
thermal control.

Specifics:

- Untangle the initialization and updates of passive and active trip
points in the ACPI thermal driver (Rafael Wysocki)

- Reduce code duplication related to the initialization and updates
of trip points in the ACPI thermal driver (Rafael Wysocki)

- Use trip pointers for cooling device binding in the ACPI thermal
driver (Rafael Wysocki)

- Simplify critical and hot trips representation in the ACPI thermal
driver (Rafael Wysocki)

- Use trip pointers in thermal governors and in the related part of
the thermal core (Rafael Wysocki)

- Drop the trips_disabled bitmask that has become redundant from the
thermal core (Rafael Wysocki)

- Avoid updating trip points when the thermal zone temperature falls
into a trip point's hysteresis range (ícolas F. R. A. Prado)

- Add power floor notifications support to the int340x thermal
control driver (Srinivas Pandruvada)

- Rework updating trip points in the int340x thermal driver so that
it does not access thermal zone internals directly (Rafael
Wysocki)

- Use param_get_byte() instead of param_get_int() as the max_idle
module parameter .get() callback in the Intel powerclamp thermal
driver to avoid possible out-of-bounds access (David Arcari)

- Add workload hints support to the int340x thermal driver (Srinivas
Pandruvada)

- Add support for Mediatek LVTS MT8192 along with suspend/resume
routines (Balsam Chihi)

- Fix probe for THERMAL_V2 in the Mediatek LVTS driver (Markus
Schneider-Pargmann)

- Remove duplicate error message from the max76620 driver when
thermal_of_zone_register() fails (Thierry Reding)

- Add i.MX7D compatible bindings to fix a warning from dtbs_check for
the imx6ul platform (Alexander Stein)

- Add sa8775p compatible to the QCom tsens driver (Priyansh Jain)

- Fix error check in lvts_debugfs_init() to be against PTR_ERR() in
the LVTS Mediatek driver (Minjie Du)

- Remove unused variable in thermal/tools (Kuan-Wei Chiu)

- Document the imx8dl thermal sensor (Fabio Estevam)

- Add variable names in callback prototypes to prevent warning from
checkpatch.pl in the imx8mm driver (Bragatheswaran Manickavel)

- Add missing unevaluatedProperties on child node schemas for
tegra124 (Rob Herring)

- Add mt7988 support to the Mediatek LVTS driver (Frank Wunderlich)"

* tag 'thermal-6.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (111 commits)
thermal: ACPI: Include the right header file
thermal: core: Don't update trip points inside the hysteresis range
thermal: core: Pass trip pointer to governor throttle callback
thermal: gov_step_wise: Fold update_passive_instance() into its caller
thermal: gov_power_allocator: Use trip pointers instead of trip indices
thermal: gov_fair_share: Rearrange get_trip_level()
thermal: trip: Define for_each_trip() macro
thermal: trip: Simplify computing trip indices
thermal/qcom/tsens: Drop ops_v0_1
thermal/drivers/mediatek/lvts_thermal: Update calibration data documentation
thermal/drivers/mediatek/lvts_thermal: Add mt8192 support
thermal/drivers/mediatek/lvts_thermal: Add suspend and resume
dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for mt8192
thermal/drivers/mediatek: Fix probe for THERMAL_V2
thermal/drivers/max77620: Remove duplicate error message
dt-bindings: timer: add imx7d compatible
dt-bindings: net: microchip: Allow nvmem-cell usage
dt-bindings: imx-thermal: Add #thermal-sensor-cells property
dt-bindings: thermal: tsens: Add sa8775p compatible
thermal/drivers/mediatek/lvts_thermal: Fix error check in lvts_debugfs_init()
...

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Merge branch 'thermal-intel'

Merge changes in Intel thermal control drivers for 6.7-rc1:

- Add power floor notifications support to the int340x thermal control
driver (Srinivas Pandruvada).

-

Merge branch 'thermal-intel'

Merge changes in Intel thermal control drivers for 6.7-rc1:

- Add power floor notifications support to the int340x thermal control
driver (Srinivas Pandruvada).

- Rework updating trip points in the int340x thermal driver so that it
does not access thermal zone internals directly (Rafael Wysocki).

- Use param_get_byte() instead of param_get_int() as the max_idle module
parameter .get() callback in the Intel powerclamp thermal driver to
avoid possible out-of-bounds access (David Arcari).

- Add workload hints support to the the int340x thermal driver (Srinivas
Pandruvada).

* thermal-intel:
selftests/thermel/intel: Add test to read power floor status
thermal: int340x: processor_thermal: Enable power floor support
thermal: int340x: processor_thermal: Handle power floor interrupts
thermal: int340x: processor_thermal: Support power floor notifications
thermal: int340x: processor_thermal: Set feature mask before proc_thermal_add
thermal: int340x: processor_thermal: Common function to clear SOC interrupt
thermal: int340x: processor_thermal: Move interrupt status MMIO offset to common header
thermal: intel: powerclamp: fix mismatch in get function for max_idle
thermal: int340x: Use thermal_zone_for_each_trip()
thermal: int340x: processor_thermal: Ack all PCI interrupts
thermal: int340x: Add ArrowLake-S PCI ID
selftests/thermel/intel: Add test to read workload hint
thermal: int340x: Handle workload hint interrupts
thermal: int340x: processor_thermal: Add workload type hint interface
thermal: int340x: Remove PROC_THERMAL_FEATURE_WLT_REQ for Meteor Lake
thermal: int340x: processor_thermal: Use non MSI interrupts by default
thermal: int340x: processor_thermal: Add interrupt configuration function
thermal: int340x: processor_thermal: Move mailbox code to common module

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thermal: int340x: processor_thermal: Support power floor notifications

When the hardware reduces the power to the minimum possible, the power
floor is notified via an interrupt.

This can happen whe

thermal: int340x: processor_thermal: Support power floor notifications

When the hardware reduces the power to the minimum possible, the power
floor is notified via an interrupt.

This can happen when user space requests a power limit via powercap RAPL
interface, which forces the system to enter to the lowest power. This
power floor indication can be used as a hint to resort to other methods
of reducing power than via RAPL power limit.

Before power floor status can be read or the firmware can trigger
notifications regarding it, it needs to be configured via a mailbox
command. The actual power floor status is read via bit 39 of MMIO
offset 0x5B18 of the processor thermal PCI device.

To show the current power floor status and get notification
on a sysfs attribute, add 2 new attributes to
/sys/bus/pci/devices/0000\:00\:04.0/power_limits/

power_floor_enable : This attribute is present when power floor
notifications are supported. This attribute allows to enable/disable
power floor notifications.

power_floor_status : This attribute is present when power floor
notifications are supported. When enabled via power_floor_enable, this
attribute shows the current power floor status.

The power floor implementation provides interfaces which are called
from the sysfs callbacks to enable/disable and read power floor
status. It also provides two additional interfaces to check if the
current processor thermal device interrupt is for power floor status
and to send notifications to user space.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Changelog and documentation changes edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

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Merge earlier changes in Intel thermal drivers for v6.7.

thermal: int340x: processor_thermal: Add workload type hint interface

Prior to Meteor Lake processor generation, user space can pass workload
type request to the firmware. Then firmware can optimize

thermal: int340x: processor_thermal: Add workload type hint interface

Prior to Meteor Lake processor generation, user space can pass workload
type request to the firmware. Then firmware can optimize power based on
the indicated workload type. User space also uses workload type requests
to implement its own heuristics.

The firmware in Meteor Lake processor generation is capable of predicting
workload type without software help.

To avoid duplicate processing, add a sysfs interface allowing user space
to obtain the workload hint from the firmware instead of trying to
predict the workload type by itself.

This workload hint is passed from the firmware via MMIO offset 0x5B18 of
the processor thermal PCI device. Before workload hints can be produced by
the firmware, it needs to be configured via a mailbox command. This
mailbox command turns ON the workload hint and it allows to program a
notification delay to control the rate of notifications.

The notification delay can be changed from user space vis sysfs.

Attribute group 'workload_hint' in sysfs is used for implementing the
workload hints interface between user space and the kernel.

It contains the following attributes:

workload_type_enable:
Enables/disables workload type hints from the firmware.

notification_delay_ms:
Notification delay in milliseconds.

workload_type_index:
The current workload type index predicted by the firmware (see
the documentation changes below for supported index values and
their meaning).

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Changelog edits, documentation edits, whitespace adjustments ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

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thermal: int340x: processor_thermal: Move mailbox code to common module

The processor thermal mailbox is used for workload type request and
also in the processor thermal RFIM module. So, move the wo

thermal: int340x: processor_thermal: Move mailbox code to common module

The processor thermal mailbox is used for workload type request and
also in the processor thermal RFIM module. So, move the workload type
request code to its own module from the current processor thermal
mailbox module.

processor_thermal_mailbox.c contains only mailbox read/write related
source code. The source related to workload_types requests is moved to
a module processor_thermal_wt_req.c.

In addition
- Rename PROC_THERMAL_FEATURE_MBOX to PROC_THERMAL_FEATURE_WT_REQ.
- proc_thermal_mbox_add(), which adds workload type sysfs attribute group
is renamed to proc_thermal_wt_req_add().
- proc_thermal_mbox_remove() is renamed to proc_thermal_wt_req_remove().

While here, resolve check patch warnings for 100 columns for only modified
lines.

No functional changes are expected.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

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Merge branch 'next' into for-linus

Prepare input updates for 5.17 merge window.

Merge tag 'v5.15' into next

Sync up with the mainline to get the latest APIs and DT bindings.

Merge branch 'for-5.15-printk-index' into for-linus

Merge branch 'perf/urgent' into perf/core, to pick up fixes

Signed-off-by: Ingo Molnar <mingo@kernel.org>

Merge tag 'v5.14-rc6' into locking/core, to pick up fixes

Signed-off-by: Ingo Molnar <mingo@kernel.org>

Backmerge remote-tracking branch 'drm/drm-next' into drm-misc-next

Required bump from v5.13-rc3 to v5.14-rc3, and to pick up sysfb compilation fixes.

Signed-off-by: Maarten Lankhorst <maarten.lankh

Backmerge remote-tracking branch 'drm/drm-next' into drm-misc-next

Required bump from v5.13-rc3 to v5.14-rc3, and to pick up sysfb compilation fixes.

Signed-off-by: Maarten Lankhorst <maarten.lankhorst@linux.intel.com>

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Merge drm/drm-next into drm-intel-gt-next

Catching up with 5.14-rc1 and also preparing for a
needed common topic branch for the "Minor revid/stepping
and workaround cleanup"

Reference: https://patc

Merge drm/drm-next into drm-intel-gt-next

Catching up with 5.14-rc1 and also preparing for a
needed common topic branch for the "Minor revid/stepping
and workaround cleanup"

Reference: https://patchwork.freedesktop.org/series/92299/
Signed-off-by: Rodrigo Vivi <rodrigo.vivi@intel.com>

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Merge drm/drm-next into drm-intel-next

Catching up with 5.14-rc1

Signed-off-by: Rodrigo Vivi <rodrigo.vivi@intel.com>

Merge branch 'fixes-v5.14' into fixes

Merge tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal updates from Daniel Lezcano:

- Add rk3568 sensor support (Finley Xiao)

- Add missing MOD

Merge tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal updates from Daniel Lezcano:

- Add rk3568 sensor support (Finley Xiao)

- Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
Zhang)

- Export additionnal attributes for the int340x thermal processor
(Srinivas Pandruvada)

- Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
Kamble)

- Fix kernel documentation for thermal_zone_device_unregister() and use
devm_platform_get_and_ioremap_resource() (Yang Yingliang)

- Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
Söderlund)

- Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)

- Add missing of_node_put() for the iMX and Spreadtrum sensors
(Krzysztof Kozlowski)

- Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)

- Stop the thermal zone monitoring when unregistering it to prevent a
temperature update without the 'get_temp' callback (Dmitry Osipenko)

- Add rk3568 DT bindings, convert bindings to yaml schemas and add the
corresponding compatible in the Rockchip sensor (Ezequiel Garcia)

- Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)

- Use the find_first_zero_bit() function instead of custom code (Andy
Shevchenko)

- Fix the kernel doc for the device cooling device (Yang Li)

- Reorg the processor thermal int340x to set the scene for the PCI mmio
driver (Srinivas Pandruvada)

- Add PCI MMIO driver for the int340x processor thermal driver
(Srinivas Pandruvada)

- Add hwmon sensors for the mediatek sensor (Frank Wunderlich)

- Fix warning for return value reported by Smatch for the int340x
thermal processor (Srinivas Pandruvada)

- Fix wrong register access and decoding for the int340x thermal
processor (Srinivas Pandruvada)

* tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (23 commits)
thermal/drivers/int340x/processor_thermal: Fix tcc setting
thermal/drivers/int340x/processor_thermal: Fix warning for return value
thermal/drivers/mediatek: Add sensors-support
thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver
thermal/drivers/int340x/processor_thermal: Split enumeration and processing part
thermal: devfreq_cooling: Fix kernel-doc
thermal/drivers/intel/intel_soc_dts_iosf: Switch to use find_first_zero_bit()
dt-bindings: thermal: tsens: Add sc8180x compatible
dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible
dt-bindings: thermal: convert rockchip-thermal to json-schema
thermal/core/thermal_of: Stop zone device before unregistering it
dt-bindings: thermal: Add binding for Tegra30 thermal sensor
thermal/drivers/sprd: Add missing of_node_put for loop iteration
thermal/drivers/imx_sc: Add missing of_node_put for loop iteration
thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1
thermal/drivers/rcar_gen3_thermal: Fix coefficient calculations
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
thermal/core: Correct function name thermal_zone_device_unregister()
dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
thermal/drivers/int340x: processor_thermal: Export additional attributes
...

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thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver

Add a new PCI driver which register a thermal zone and allows to get
notification for threshold violation by a RW trip po

thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver

Add a new PCI driver which register a thermal zone and allows to get
notification for threshold violation by a RW trip point. These
notifications are delivered from the device using MSI based
interrupt.

The main difference between this new PCI driver and the existing
one is that the temperature and trip points directly use PCI
MMIO instead of using ACPI methods.

This driver registers a thermal zone "TCPU_PCI" in addition to the
legacy processor thermal device, which uses ACPI companion device
to set name, temperature and trips.

This driver is enabled for AlderLake.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210525204811.3793651-3-srinivas.pandruvada@linux.intel.com

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