| /linux/Documentation/devicetree/bindings/thermal/ |
| H A D | thermal-cooling-devices.yaml | 21 - cooling-device: device used to dissipate heat either passively or actively
32 dissipated heat, e.g. regulating fan speeds.
35 heat dissipation). They also have a way to determine the state of cooling in
38 unsigned integers, where larger numbers mean greater heat dissipation. The
|
| H A D | thermal-sensor.yaml | 21 - cooling-device: device used to dissipate heat either passively or actively
|
| H A D | thermal-zones.yaml | 21 - cooling-device: device used to dissipate heat either passively or actively
|
| /linux/Documentation/devicetree/bindings/power/supply/ |
| H A D | maxim,max17042.yaml | 44 maxim,over-heat-temp:
80 maxim,over-heat-temp = <600>;
|
| /linux/Documentation/userspace-api/ |
| H A D | sysfs-platform_profile.rst | 24 performance may be limited by various factors such as: the heat generated
31 profile will adjust (power consumption, heat generation, etc) this API
|
| /linux/drivers/of/unittest-data/ |
| H A D | overlay_bad_symbol.dtso | 11 heat-range = <50 75>;
|
| H A D | overlay.dtso | 10 heat-range = <40 75>;
|
| H A D | overlay_common.dtsi | 24 heat-range = <50 75>;
|
| /linux/drivers/usb/serial/ |
| H A D | whiteheat.c | 171 * Connect Tech's White Heat prerenumeration driver functions
210 * Connect Tech's White Heat serial driver functions
459 * Connect Tech's White Heat callback routines
527 * Connect Tech's White Heat firmware interface
755 * Connect Tech's White Heat utility functions
|
| /linux/arch/arm64/boot/dts/qcom/ |
| H A D | msm8916-motorola-surnia.dts | 26 maxim,over-heat-temp = <600>;
|
| H A D | msm8916-motorola-osprey.dts | 37 maxim,over-heat-temp = <600>;
|
| H A D | msm8916-motorola-harpia.dts | 26 maxim,over-heat-temp = <600>;
|
| H A D | msm8916-samsung-gt5-common.dtsi | 107 maxim,over-heat-temp = <600>;
|
| /linux/drivers/net/ethernet/sfc/siena/ |
| H A D | mcdi_mon.c | 44 SENSOR(CONTROLLER_COOLING, "Controller heat sink", COOL, -1),
46 SENSOR(PHY0_COOLING, "PHY heat sink", COOL, 0),
48 SENSOR(PHY1_COOLING, "PHY heat sink", COOL, 1),
|
| /linux/drivers/net/ethernet/sfc/ |
| H A D | mcdi_mon.c | 44 SENSOR(CONTROLLER_COOLING, "Controller heat sink", COOL, -1),
46 SENSOR(PHY0_COOLING, "PHY heat sink", COOL, 0),
48 SENSOR(PHY1_COOLING, "PHY heat sink", COOL, 1),
|
| /linux/Documentation/hwmon/ |
| H A D | k8temp.rst | 48 This temperature is defined as temperature between heat-spreader and CPU
|
| /linux/Documentation/input/devices/ |
| H A D | appletouch.rst | 71 The touchpad sensors are very sensitive to heat, and will generate a lot of
|
| /linux/Documentation/scsi/ |
| H A D | qlogicfas.rst | 83 work less well because of the heat, or when cables get too long for
|
| /linux/Documentation/arch/x86/ |
| H A D | intel-hfi.rst | 35 excessive heat, the HFI may reflect reduced performance on specific CPUs.
|
| /linux/drivers/macintosh/ |
| H A D | windfarm_mpu.h | 62 fs32 theta_heat_sink; /* 0x48 - Theta heat sink */
|
| /linux/drivers/thermal/ti-soc-thermal/ |
| H A D | omap3-thermal-data.c | 15 * generating heat has to be a factor as well. If you are just looking
|
| /linux/Documentation/driver-api/thermal/ |
| H A D | cpu-idle-cooling.rst | 62 another way to control CPU power and heat in addition to
|
| /linux/drivers/hwmon/ |
| H A D | aht10.c | 69 * the chip from warming up due to the heat it generates.
|
| /linux/include/linux/ |
| H A D | thermal.h | 158 * Sustainable power (heat) that this thermal zone can dissipate in
|
| H A D | lru_cache.h | 30 the active set before we can "heat" a previously unused region.
|