| /linux/drivers/ras/amd/atl/ |
| H A D | map.c | 578 u8 dies = 0; in get_num_intlv_dies() local
582 dies = FIELD_GET(DF2_INTLV_NUM_DIES, ctx->map.limit); in get_num_intlv_dies()
585 dies = FIELD_GET(DF3_INTLV_NUM_DIES, ctx->map.base); in get_num_intlv_dies()
588 dies = FIELD_GET(DF3p5_INTLV_NUM_DIES, ctx->map.base); in get_num_intlv_dies()
592 dies = FIELD_GET(DF4_INTLV_NUM_DIES, ctx->map.intlv); in get_num_intlv_dies()
600 return 1 << dies; in get_num_intlv_dies()
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| /linux/Documentation/kbuild/ |
| H A D | gendwarfksyms.rst | 50 --dump-dies Dump DWARF DIE contents
108 DWARF format produced by **--dump-dies**, but with type references
182 (as shown in **--dump-dies** output).
209 (as shown in **--dump-dies** output) and the name of the
234 (as shown in **--dump-dies** output) and the name of the
270 (as shown in **--dump-dies** output).
306 (as shown in **--dump-dies** output) or symbol.
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| /linux/arch/arm/boot/dts/socionext/ |
| H A D | uniphier-ld6b.dtsi | 9 * LD6b consists of two silicon dies: D-chip and A-chip.
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| /linux/Documentation/admin-guide/perf/ |
| H A D | hisi-pmu.rst | 10 The HiSilicon SoC encapsulates multiple CPU and IO dies. Each CPU cluster
100 4. Some HiSilicon SoCs encapsulate multiple CPU and IO dies. Each CPU die
101 contains several Compute Clusters (CCLs). The I/O dies are called Super I/O
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| /linux/drivers/soc/hisilicon/ |
| H A D | kunpeng_hccs.h | 56 struct hccs_die_info *dies; member
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| /linux/include/linux/mtd/ |
| H A D | onenand.h | 85 unsigned dies; member
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| /linux/drivers/mtd/nand/onenand/ |
| H A D | onenand_base.c | 3405 for (die = 0; die < this->dies; die++) { in flexonenand_get_boundary()
3449 mtd->numeraseregions = this->dies << 1; in flexonenand_get_size()
3455 for (; die < this->dies; die++) { in flexonenand_get_size()
3495 for (die = 0, mtd->size = 0; die < this->dies; die++) { in flexonenand_get_size()
3727 this->dies = ONENAND_IS_DDP(this) ? 2 : 1; in onenand_probe()
3729 mtd->numeraseregions = this->dies << 1; in onenand_probe()
3732 this->dies << 1); in onenand_probe()
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| /linux/tools/perf/Documentation/ |
| H A D | perf.data-file-format.txt | 181 struct perf_header_string_list dies; /* Variable length */
187 sibling dies : 0-3
188 sibling dies : 4-7
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| H A D | perf-stat.txt | 306 is a useful mode to detect imbalance between dies. To enable this mode,
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| /linux/Documentation/filesystems/nfs/ |
| H A D | rpc-server-gss.rst | 86 /proc/net/rpc/use-gss-proxy. If gss-proxy dies, it must repeat both
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| H A D | rpc-cache.rst | 182 If it dies and needs to be restarted, any requests that have not been
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| /linux/Documentation/locking/ |
| H A D | ww-mutex-design.rst | 41 and dies. Hence Wait-Die.
54 Wound-Wait transaction is considered preempted when it dies (returning
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| H A D | robust-futexes.rst | 113 kernel to clean up if the thread dies after acquiring the lock, but just
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| /linux/Documentation/target/ |
| H A D | tcmu-design.rst | 90 3) dies
117 the ring to still work if the user process dies and is restarted with
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| /linux/Documentation/devicetree/bindings/mtd/ |
| H A D | atmel-nand.txt | 34 exposes multiple CS lines (multi-dies chips), your reg property will
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| /linux/Documentation/leds/ |
| H A D | ledtrig-transient.rst | 158 long as the app is alive, it can keep the LED illuminated, if it dies
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| /linux/scripts/ |
| H A D | Kbuild.include | 139 # Make dies with SIGPIPE before cleaning the targets.
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| /linux/Documentation/driver-api/ |
| H A D | edac.rst | 112 communication lanes. It uses vertically stacked memory chips (DRAM dies)
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| /linux/Documentation/networking/ |
| H A D | eql.rst | 128 an enslaved device "dies", it is automatically taken out of the queue.
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| /linux/Documentation/filesystems/fuse/ |
| H A D | fuse.rst | 26 connection exists until either the daemon dies, or the filesystem is
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| /linux/Documentation/arch/x86/ |
| H A D | topology.rst | 60 The maximum number of dies in a package.
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| /linux/tools/power/cpupower/po/ |
| H A D | de.po | 413 " [nur der Administrator kann dies tun] *\n"
|