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| H A D | Makefile | diff 9ad1df2b15b0f1952a57c3407996450cc64bc976 Wed Dec 19 14:33:10 CET 2012 Javier Martinez Canillas <javier.martinez@collabora.co.uk> ARM: dts: omap3: Add support for IGEP COM Module
ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.
This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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