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/linux/Documentation/devicetree/bindings/thermal/
H A Dbrcm,sr-thermal.txt1 * Broadcom Stingray Thermal
3 This binding describes thermal sensors that is part of Stingray SoCs.
6 - compatible : Must be "brcm,sr-thermal"
7 - reg : Memory where tmon data will be available.
8 - brcm,tmon-mask: A one cell bit mask of valid TMON sources.
10 - #thermal-sensor-cells : Thermal sensor phandler
11 - polling-delay: Max number of milliseconds to wait between polls.
12 - thermal-sensors: A list of thermal sensor phandles and specifier.
14 in correspond with brcm,tmon-mask.
15 - temperature: trip temperature threshold in millicelsius.
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H A Dthermal-zones.yaml1 # SPDX-License-Identifier: (GPL-2.0)
4 ---
5 $id: http://devicetree.org/schemas/thermal/thermal-zones.yaml#
6 $schema: http://devicetree.org/meta-schemas/base.yaml#
8 title: Thermal zone
11 - Daniel Lezcano <daniel.lezcano@linaro.org>
14 Thermal management is achieved in devicetree by describing the sensor hardware
15 and the software abstraction of cooling devices and thermal zones required to
16 take appropriate action to mitigate thermal overloads.
18 The following node types are used to completely describe a thermal management
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H A Dthermal-sensor.yaml1 # SPDX-License-Identifier: (GPL-2.0)
4 ---
5 $id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml#
6 $schema: http://devicetree.org/meta-schemas/core.yaml#
8 title: Thermal sensor
11 - Amit Kucheria <amitk@kernel.org>
14 Thermal management is achieved in devicetree by describing the sensor hardware
15 and the software abstraction of thermal zones required to take appropriate
16 action to mitigate thermal overloads.
18 The following node types are used to completely describe a thermal management
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H A Dimx8mm-thermal.yaml1 # SPDX-License-Identifier: GPL-2.0
3 ---
4 $id: http://devicetree.org/schemas/thermal/imx8mm-thermal.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: NXP i.MX8M Mini Thermal
10 - Shawn Guo <shawnguo@kernel.org>
11 - Sascha Hauer <s.hauer@pengutronix.de>
12 - Fabio Estevam <festevam@gmail.com>
19 2 sensors.
21 $ref: thermal-sensor.yaml#
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H A Dnvidia,tegra30-tsensor.yaml1 # SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
3 ---
4 $id: http://devicetree.org/schemas/thermal/nvidia,tegra30-tsensor.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: NVIDIA Tegra30 Thermal Sensor
10 - Dmitry Osipenko <digetx@gmail.com>
11 - Jon Hunter <jonathanh@nvidia.com>
12 - Thierry Reding <thierry.reding@gmail.com>
15 TSENSOR provides thermal and voltage sensors which monitor temperature
16 and voltage of the chip. Sensors are placed across the die to gauge the
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/linux/arch/arm64/boot/dts/ti/
H A Dk3-j721s2-thermal.dtsi1 // SPDX-License-Identifier: GPL-2.0-only OR MIT
3 * Copyright (C) 2023-2024 Texas Instruments Incorporated - https://www.ti.com/
6 #include <dt-bindings/thermal/thermal.h>
8 wkup0_thermal: wkup0-thermal {
9 polling-delay-passive = <250>; /* milliseconds */
10 polling-delay = <500>; /* milliseconds */
11 thermal-sensors = <&wkup_vtm0 0>;
14 wkup0_crit: wkup0-crit {
22 wkup1_thermal: wkup1-thermal {
23 polling-delay-passive = <250>; /* milliseconds */
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H A Dk3-j721e-thermal.dtsi1 // SPDX-License-Identifier: GPL-2.0-only OR MIT
3 * Copyright (C) 2023-2024 Texas Instruments Incorporated - https://www.ti.com/
6 #include <dt-bindings/thermal/thermal.h>
8 thermal_zones: thermal-zones {
9 wkup_thermal: wkup-thermal {
10 polling-delay-passive = <250>; /* milliseconds */
11 polling-delay = <500>; /* milliseconds */
12 thermal-sensors = <&wkup_vtm0 0>;
15 wkup_crit: wkup-crit {
23 mpu_thermal: mpu-thermal {
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H A Dk3-am62a-thermal.dtsi1 // SPDX-License-Identifier: GPL-2.0-only OR MIT
3 * Copyright (C) 2023-2024 Texas Instruments Incorporated - https://www.ti.com/
6 #include <dt-bindings/thermal/thermal.h>
8 thermal_zones: thermal-zones {
9 main0_thermal: main0-thermal {
10 polling-delay-passive = <250>; /* milliSeconds */
11 polling-delay = <500>; /* milliSeconds */
12 thermal-sensors = <&wkup_vtm0 0>;
15 main0_crit: main0-crit {
23 main1_thermal: main1-thermal {
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H A Dk3-j7200-thermal.dtsi1 // SPDX-License-Identifier: GPL-2.0-only OR MIT
3 * Copyright (C) 2023-2024 Texas Instruments Incorporated - https://www.ti.com/
6 #include <dt-bindings/thermal/thermal.h>
8 thermal_zones: thermal-zones {
9 mcu_thermal: mcu-thermal {
10 polling-delay-passive = <250>; /* milliseconds */
11 polling-delay = <500>; /* milliseconds */
12 thermal-sensors = <&wkup_vtm0 0>;
15 wkup_crit: wkup-crit {
23 mpu_thermal: mpu-thermal {
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H A Dk3-am62p-j722s-common-thermal.dtsi1 // SPDX-License-Identifier: GPL-2.0-only OR MIT
3 * Copyright (C) 2023-2024 Texas Instruments Incorporated - https://www.ti.com/
6 #include <dt-bindings/thermal/thermal.h>
8 thermal_zones: thermal-zones {
9 main0_thermal: main0-thermal {
10 polling-delay-passive = <250>; /* milliSeconds */
11 polling-delay = <500>; /* milliSeconds */
12 thermal-sensors = <&wkup_vtm0 0>;
15 main0_crit: main0-crit {
23 main1_thermal: main1-thermal {
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H A Dk3-am654-industrial-thermal.dtsi1 // SPDX-License-Identifier: GPL-2.0-only OR MIT
3 * Copyright (C) 2020-2024 Texas Instruments Incorporated - https://www.ti.com/
6 #include <dt-bindings/thermal/thermal.h>
8 mpu0_thermal: mpu0-thermal {
9 polling-delay-passive = <250>; /* milliseconds */
10 polling-delay = <500>; /* milliseconds */
11 thermal-sensors = <&wkup_vtm0 0>;
14 mpu0_crit: mpu0-crit {
22 mpu1_thermal: mpu1-thermal {
23 polling-delay-passive = <250>; /* milliseconds */
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H A Dk3-am64-thermal.dtsi1 // SPDX-License-Identifier: GPL-2.0-only OR MIT
3 * Copyright (C) 2023-2024 Texas Instruments Incorporated - https://www.ti.com/
6 #include <dt-bindings/thermal/thermal.h>
8 thermal_zones: thermal-zones {
9 main0_thermal: main0-thermal {
10 polling-delay-passive = <250>; /* milliSeconds */
11 polling-delay = <500>; /* milliSeconds */
12 thermal-sensors = <&main_vtm0 0>;
15 main0_crit: main0-crit {
23 main1_thermal: main1-thermal {
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H A Dk3-am62-thermal.dtsi1 // SPDX-License-Identifier: GPL-2.0-only OR MIT
3 * Copyright (C) 2023-2024 Texas Instruments Incorporated - https://www.ti.com/
6 #include <dt-bindings/thermal/thermal.h>
8 thermal_zones: thermal-zones {
9 main0_thermal: main0-thermal {
10 polling-delay-passive = <250>; /* milliSeconds */
11 polling-delay = <500>; /* milliSeconds */
12 thermal-sensors = <&wkup_vtm0 0>;
15 main0_alert: main0-alert {
21 main0_crit: main0-crit {
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/linux/drivers/thermal/mediatek/
H A Dauxadc_thermal.c1 // SPDX-License-Identifier: GPL-2.0-only
15 #include <linux/nvmem-consumer.h>
21 #include <linux/thermal.h>
36 /* Thermal Controller Registers */
93 /* MT8173 thermal sensors */
100 /* AUXADC channel 11 is used for the temperature sensors */
103 /* The total number of temperature sensors in the MT8173 */
119 #define MT8173_TEMP_MIN -20000
125 * MT8183 has 6 sensors and needs 6 VTS calibration data.
126 * MT8173 has 5 sensors and needs 5 VTS calibration data.
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/linux/arch/arm64/boot/dts/arm/
H A Djuno-scmi.dtsi3 power-domains = <&scmi_devpd 8>;
7 power-domains = <&scmi_devpd 8>;
11 power-domains = <&scmi_devpd 8>;
15 power-domains = <&scmi_devpd 8>;
19 power-domains = <&scmi_devpd 8>;
23 power-domains = <&scmi_devpd 8>;
27 power-domains = <&scmi_devpd 8>;
31 power-domains = <&scmi_devpd 8>;
42 /delete-node/ scpi;
47 mbox-names = "tx", "rx";
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/linux/drivers/thermal/st/
H A DKconfig1 # SPDX-License-Identifier: GPL-2.0-only
3 # STMicroelectronics thermal drivers configuration
7 tristate "Thermal sensors on STMicroelectronics STi series of SoCs"
9 Support for thermal sensors on STMicroelectronics STi series of SoCs.
13 tristate "STi series memory mapped access based thermal sensors"
16 tristate "Thermal framework support on STMicroelectronics STM32 series of SoCs"
20 Support for thermal framework on STMicroelectronics STM32 series of
21 SoCs. This thermal driver allows to access to general thermal framework
/linux/drivers/thermal/broadcom/
H A DKconfig1 # SPDX-License-Identifier: GPL-2.0-only
3 tristate "Broadcom AVS RO thermal sensor driver"
7 Support for thermal sensors on Broadcom BCM2711 SoCs.
10 tristate "Thermal sensors on bcm2835 SoC"
15 Support for thermal sensors on Broadcom bcm2835 SoCs.
18 tristate "Broadcom STB AVS TMON thermal driver"
22 thermal framework support.
25 tristate "Northstar thermal driver"
31 Management Unit) block with a thermal sensor that allows checking CPU
35 tristate "Stingray thermal driver"
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/linux/arch/arm64/boot/dts/qcom/
H A Dpm8550vs.dtsi1 // SPDX-License-Identifier: BSD-3-Clause
6 #include <dt-bindings/interrupt-controller/irq.h>
7 #include <dt-bindings/spmi/spmi.h>
10 thermal-zones {
11 pm8550vs-c-thermal {
12 polling-delay-passive = <100>;
14 thermal-sensors = <&pm8550vs_c_temp_alarm>;
31 pm8550vs-d-thermal {
32 polling-delay-passive = <100>;
34 thermal-sensors = <&pm8550vs_d_temp_alarm>;
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H A Dsa8775p-pmics.dtsi1 // SPDX-License-Identifier: BSD-3-Clause
6 #include <dt-bindings/input/input.h>
7 #include <dt-bindings/spmi/spmi.h>
10 thermal-zones {
11 pmm8654au_0_thermal: pm8775-0-thermal {
12 polling-delay-passive = <100>;
14 thermal-sensors = <&pmm8654au_0_temp_alarm>;
31 pmm8654au_1_thermal: pm8775-1-thermal {
32 polling-delay-passive = <100>;
34 thermal-sensors = <&pmm8654au_1_temp_alarm>;
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H A Dpm8010.dtsi1 // SPDX-License-Identifier: BSD-3-Clause
6 #include <dt-bindings/interrupt-controller/irq.h>
7 #include <dt-bindings/spmi/spmi.h>
10 thermal-zones {
11 pm8010-m-thermal {
12 polling-delay-passive = <100>;
14 thermal-sensors = <&pm8010_m_temp_alarm>;
31 pm8010-n-thermal {
32 polling-delay-passive = <100>;
34 thermal-sensors = <&pm8010_n_temp_alarm>;
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/linux/arch/arm/boot/dts/samsung/
H A Dexynos5422-odroidhc1.dts1 // SPDX-License-Identifier: GPL-2.0
10 /dts-v1/;
11 #include <dt-bindings/leds/common.h>
12 #include "exynos5422-odroid-core.dtsi"
16 compatible = "hardkernel,odroid-hc1", "samsung,exynos5800", \
19 led-controller {
20 compatible = "pwm-leds";
22 led-1 {
26 pwm-names = "pwm2";
27 max-brightness = <255>;
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/linux/Documentation/devicetree/bindings/firmware/
H A Darm,scpi.yaml1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 ---
6 $schema: http://devicetree.org/meta-schemas/core.yaml#
11 - Sudeep Holla <sudeep.holla@arm.com>
33 - const: arm,scpi # SCPI v1.0 and above
34 - const: arm,scpi-pre-1.0 # Unversioned SCPI before v1.0
35 - items:
36 - enum:
37 - amlogic,meson-gxbb-scpi
38 - const: arm,scpi-pre-1.0
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/linux/tools/thermal/tmon/
H A DREADME1 TMON - A Monitoring and Testing Tool for Linux kernel thermal subsystem
6 thermal relationship between processor and fan has become past for modern
9 As hardware vendors cope with the thermal constraints on their products, more
10 and more sensors are added, new cooling capabilities are introduced. The
11 complexity of the thermal relationship can grow exponentially among cooling
12 devices, zones, sensors, and trip points. They can also change dynamically.
14 To expose such relationship to the userspace, Linux generic thermal layer
15 introduced sysfs entry at /sys/class/thermal with a matrix of symbolic
18 thermal conditions are often exception cases that hard to reach in
22 complex thermal subsystem.
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/linux/arch/arm64/boot/dts/exynos/
H A Dexynos5433-tmu.dtsi1 // SPDX-License-Identifier: GPL-2.0
3 * Device tree sources for Exynos5433 thermal zone
8 #include <dt-bindings/thermal/thermal.h>
11 thermal-zones {
12 atlas0_thermal: atlas0-thermal {
13 thermal-sensors = <&tmu_atlas0>;
14 polling-delay-passive = <0>;
15 polling-delay = <0>;
17 atlas0_alert_0: atlas0-alert-0 {
22 atlas0_alert_1: atlas0-alert-1 {
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/linux/drivers/thermal/ti-soc-thermal/
H A Dti-bandgap.h1 /* SPDX-License-Identifier: GPL-2.0-only */
5 * Copyright (C) 2011 Texas Instruments Incorporated - http://www.ti.com/
26 * +----------+----------------+
28 * +---------------------------+
32 * +-------------------+ +-----------------+
33 * | struct ti_bandgap |-->| struct device * |
34 * +----------+--------+ +-----------------+
38 * +------------------------+
40 * +------------------------+
44 * +------------+------------------------------------------------------+
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