Lines Matching +full:batt +full:- +full:detect
15 - thermal sensors: devices which may be used to take temperature
17 - cooling devices: devices which may be used to dissipate heat.
18 - trip points: describe key temperatures at which cooling is recommended. The
20 - cooling maps: used to describe links between trip points and cooling devices;
21 - thermal zones: used to describe thermal data within the hardware;
33 - #thermal-sensor-cells: Used to provide sensor device specific information
62 - #cooling-cells: Used to provide cooling device specific information
78 - temperature: An integer indicating the trip temperature level,
82 - hysteresis: A low hysteresis value on temperature property (above).
86 - type: a string containing the trip type. Expected values are:
100 - cooling-device: A list of phandles of cooling devices with their specifiers,
105 - trip: A phandle of a trip point node within the same thermal
110 - contribution: The cooling contribution to the thermal zone of the
115 Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle
117 (i) - minimum state allowed for minimum cooling state used in the reference.
118 (ii) - maximum state allowed for maximum cooling state used in the reference.
119 Refer to include/dt-bindings/thermal/thermal.h for definition of this constant.
125 thermal zone node must contain, apart from its own properties, one sub-node
126 containing trip nodes and one sub-node containing all the zone cooling maps.
129 - polling-delay: The maximum number of milliseconds to wait between polls
133 - polling-delay-passive: The maximum number of milliseconds to wait
137 - thermal-sensors: A list of thermal sensor phandles and sensor specifier
142 - trips: A sub-node which is a container of only trip point nodes
143 Type: sub-node required to describe the thermal zone.
146 - cooling-maps: A sub-node which is a container of only cooling device
147 Type: sub-node map nodes, used to describe the relation between trips
150 - coefficients: An array of integers (one signed cell) containing
152 Elem size: one cell the sensors listed in the thermal-sensors property.
155 Z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn.
161 - sustainable-power: An estimate of the sustainable power (in mW) that the
170 (i) - when passive cooling is activated (polling-delay-passive); and
171 (ii) - when the zone just needs to be monitored (polling-delay) or
181 * The thermal-zones node
183 The "thermal-zones" node is a container for all thermal zone nodes. It shall
184 contain only sub-nodes describing thermal zones as in the section
185 "Thermal zone nodes". The "thermal-zones" node appears under "/".
192 (a) - CPU thermal zone
198 #include <dt-bindings/thermal/thermal.h>
212 operating-points = <
219 #cooling-cells = <2>; /* min followed by max */
228 * (represented as 0-9).
232 #cooling-cells = <2>; /* min followed by max */
243 #thermal-sensor-cells = <0>;
247 thermal-zones {
248 cpu_thermal: cpu-thermal {
249 polling-delay-passive = <250>; /* milliseconds */
250 polling-delay = <1000>; /* milliseconds */
252 thermal-sensors = <&bandgap0>;
255 cpu_alert0: cpu-alert0 {
260 cpu_alert1: cpu-alert1 {
265 cpu_crit: cpu-crit {
272 cooling-maps {
275 cooling-device = <&fan0 THERMAL_NO_LIMIT 4>;
279 cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
286 used to monitor the zone 'cpu-thermal' using its sole sensor. A fan
288 different cooling states 0-9. It is used to remove the heat out of
289 the thermal zone 'cpu-thermal' using its cooling states
293 linked to the same thermal zone, 'cpu-thermal', as a passive cooling device,
295 which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the
299 (b) - IC with several internal sensors
304 requirements, and thus may have their own sensor to monitor or detect internal
307 #include <dt-bindings/thermal/thermal.h>
316 #thermal-sensor-cells = <1>;
320 thermal-zones {
321 cpu_thermal: cpu-thermal {
322 polling-delay-passive = <250>; /* milliseconds */
323 polling-delay = <1000>; /* milliseconds */
326 thermal-sensors = <&bandgap0 0>;
330 cpu_alert: cpu-alert {
335 cpu_crit: cpu-crit {
342 cooling-maps {
348 gpu_thermal: gpu-thermal {
349 polling-delay-passive = <120>; /* milliseconds */
350 polling-delay = <1000>; /* milliseconds */
353 thermal-sensors = <&bandgap0 1>;
357 gpu_alert: gpu-alert {
362 gpu_crit: gpu-crit {
369 cooling-maps {
375 dsp_thermal: dsp-thermal {
376 polling-delay-passive = <50>; /* milliseconds */
377 polling-delay = <1000>; /* milliseconds */
380 thermal-sensors = <&bandgap0 2>;
384 dsp_alert: dsp-alert {
389 dsp_crit: gpu-crit {
396 cooling-maps {
411 #thermal-sensor-cells property and using the first cell of the sensor
419 (c) - Several sensors within one single thermal zone
424 #include <dt-bindings/thermal/thermal.h>
433 #thermal-sensor-cells = <0>;
444 #thermal-sensor-cells = <0>;
448 thermal-zones {
449 cpu_thermal: cpu-thermal {
450 polling-delay-passive = <250>; /* milliseconds */
451 polling-delay = <1000>; /* milliseconds */
453 thermal-sensors = <&bandgap0>, /* cpu */
456 /* hotspot = 100 * bandgap - 120 * adc + 484 */
457 coefficients = <100 -120 484>;
463 cooling-maps {
475 hotspot = 100 * bandgap - 120 * adc + 484
483 thermal-sensors = <&adc>;
488 (d) - Board thermal
493 #include <dt-bindings/thermal/thermal.h>
502 #thermal-sensor-cells = <1>; /* sensor internal ID */
506 thermal-zones {
507 batt-thermal {
508 polling-delay-passive = <500>; /* milliseconds */
509 polling-delay = <2500>; /* milliseconds */
512 thermal-sensors = <&adc_dummy 4>;
518 cooling-maps {
523 board_thermal: board-thermal {
524 polling-delay-passive = <1000>; /* milliseconds */
525 polling-delay = <2500>; /* milliseconds */
528 thermal-sensors = <&adc_dummy 0>, /* pcb top edge */
536 coefficients = <1200 -345 890>;
538 sustainable-power = <2500>;
542 cpu_trip: cpu-trip {
547 gpu_trip: gpu-trip {
552 lcd_trip: lcp-trip {
557 crit_trip: crit-trip {
564 cooling-maps {
567 cooling-device = <&cpu0 0 2>;
572 cooling-device = <&gpu0 0 2>;
577 cooling-device = <&lcd0 5 10>;