Lines Matching +full:dt +full:- +full:node
15 - thermal sensors: devices which may be used to take temperature
17 - cooling devices: devices which may be used to dissipate heat.
18 - trip points: describe key temperatures at which cooling is recommended. The
20 - cooling maps: used to describe links between trip points and cooling devices;
21 - thermal zones: used to describe thermal data within the hardware;
23 The following is a description of each of these node types.
33 - #thermal-sensor-cells: Used to provide sensor device specific information
62 - #cooling-cells: Used to provide cooling device specific information
73 The trip node is a node to describe a point in the temperature domain
74 in which the system takes an action. This node describes just the point,
78 - temperature: An integer indicating the trip temperature level,
82 - hysteresis: A low hysteresis value on temperature property (above).
86 - type: a string containing the trip type. Expected values are:
95 The cooling device maps node is a node to describe how cooling devices
100 - cooling-device: A list of phandles of cooling devices with their specifiers,
105 - trip: A phandle of a trip point node within the same thermal
107 trip point node
110 - contribution: The cooling contribution to the thermal zone of the
115 Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle
117 (i) - minimum state allowed for minimum cooling state used in the reference.
118 (ii) - maximum state allowed for maximum cooling state used in the reference.
119 Refer to include/dt-bindings/thermal/thermal.h for definition of this constant.
123 The thermal zone node is the node containing all the required info
125 thermal zone node must contain, apart from its own properties, one sub-node
126 containing trip nodes and one sub-node containing all the zone cooling maps.
129 - polling-delay: The maximum number of milliseconds to wait between polls
133 - polling-delay-passive: The maximum number of milliseconds to wait
137 - thermal-sensors: A list of thermal sensor phandles and sensor specifier
142 - trips: A sub-node which is a container of only trip point nodes
143 Type: sub-node required to describe the thermal zone.
146 - cooling-maps: A sub-node which is a container of only cooling device
147 Type: sub-node map nodes, used to describe the relation between trips
150 - coefficients: An array of integers (one signed cell) containing
152 Elem size: one cell the sensors listed in the thermal-sensors property.
155 Z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn.
161 - sustainable-power: An estimate of the sustainable power (in mW) that the
168 Note: The delay properties are bound to the maximum dT/dt (temperature
170 (i) - when passive cooling is activated (polling-delay-passive); and
171 (ii) - when the zone just needs to be monitored (polling-delay) or
174 The maximum dT/dt is highly bound to hardware power consumption and dissipation
175 capability. The delays should be chosen to account for said max dT/dt,
181 * The thermal-zones node
183 The "thermal-zones" node is a container for all thermal zone nodes. It shall
184 contain only sub-nodes describing thermal zones as in the section
185 "Thermal zone nodes". The "thermal-zones" node appears under "/".
192 (a) - CPU thermal zone
198 #include <dt-bindings/thermal/thermal.h>
203 * capable CPU. The CPU node describes its four OPPs.
212 operating-points = <
219 #cooling-cells = <2>; /* min followed by max */
228 * (represented as 0-9).
232 #cooling-cells = <2>; /* min followed by max */
243 #thermal-sensor-cells = <0>;
247 thermal-zones {
248 cpu_thermal: cpu-thermal {
249 polling-delay-passive = <250>; /* milliseconds */
250 polling-delay = <1000>; /* milliseconds */
252 thermal-sensors = <&bandgap0>;
255 cpu_alert0: cpu-alert0 {
260 cpu_alert1: cpu-alert1 {
265 cpu_crit: cpu-crit {
272 cooling-maps {
275 cooling-device = <&fan0 THERMAL_NO_LIMIT 4>;
279 cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
286 used to monitor the zone 'cpu-thermal' using its sole sensor. A fan
288 different cooling states 0-9. It is used to remove the heat out of
289 the thermal zone 'cpu-thermal' using its cooling states
293 linked to the same thermal zone, 'cpu-thermal', as a passive cooling device,
295 which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the
299 (b) - IC with several internal sensors
307 #include <dt-bindings/thermal/thermal.h>
316 #thermal-sensor-cells = <1>;
320 thermal-zones {
321 cpu_thermal: cpu-thermal {
322 polling-delay-passive = <250>; /* milliseconds */
323 polling-delay = <1000>; /* milliseconds */
326 thermal-sensors = <&bandgap0 0>;
330 cpu_alert: cpu-alert {
335 cpu_crit: cpu-crit {
342 cooling-maps {
348 gpu_thermal: gpu-thermal {
349 polling-delay-passive = <120>; /* milliseconds */
350 polling-delay = <1000>; /* milliseconds */
353 thermal-sensors = <&bandgap0 1>;
357 gpu_alert: gpu-alert {
362 gpu_crit: gpu-crit {
369 cooling-maps {
375 dsp_thermal: dsp-thermal {
376 polling-delay-passive = <50>; /* milliseconds */
377 polling-delay = <1000>; /* milliseconds */
380 thermal-sensors = <&bandgap0 2>;
384 dsp_alert: dsp-alert {
389 dsp_crit: gpu-crit {
396 cooling-maps {
411 #thermal-sensor-cells property and using the first cell of the sensor
415 may be uncorrelated, having its own dT/dt requirements, trips
419 (c) - Several sensors within one single thermal zone
424 #include <dt-bindings/thermal/thermal.h>
433 #thermal-sensor-cells = <0>;
444 #thermal-sensor-cells = <0>;
448 thermal-zones {
449 cpu_thermal: cpu-thermal {
450 polling-delay-passive = <250>; /* milliseconds */
451 polling-delay = <1000>; /* milliseconds */
453 thermal-sensors = <&bandgap0>, /* cpu */
456 /* hotspot = 100 * bandgap - 120 * adc + 484 */
457 coefficients = <100 -120 484>;
463 cooling-maps {
475 hotspot = 100 * bandgap - 120 * adc + 484
483 thermal-sensors = <&adc>;
488 (d) - Board thermal
493 #include <dt-bindings/thermal/thermal.h>
502 #thermal-sensor-cells = <1>; /* sensor internal ID */
506 thermal-zones {
507 batt-thermal {
508 polling-delay-passive = <500>; /* milliseconds */
509 polling-delay = <2500>; /* milliseconds */
512 thermal-sensors = <&adc_dummy 4>;
518 cooling-maps {
523 board_thermal: board-thermal {
524 polling-delay-passive = <1000>; /* milliseconds */
525 polling-delay = <2500>; /* milliseconds */
528 thermal-sensors = <&adc_dummy 0>, /* pcb top edge */
536 coefficients = <1200 -345 890>;
538 sustainable-power = <2500>;
542 cpu_trip: cpu-trip {
547 gpu_trip: gpu-trip {
552 lcd_trip: lcp-trip {
557 crit_trip: crit-trip {
564 cooling-maps {
567 cooling-device = <&cpu0 0 2>;
572 cooling-device = <&gpu0 0 2>;
577 cooling-device = <&lcd0 5 10>;