1# 2# Generic thermal sysfs drivers configuration 3# 4 5menuconfig THERMAL 6 tristate "Generic Thermal sysfs driver" 7 help 8 Generic Thermal Sysfs driver offers a generic mechanism for 9 thermal management. Usually it's made up of one or more thermal 10 zone and cooling device. 11 Each thermal zone contains its own temperature, trip points, 12 cooling devices. 13 All platforms with ACPI thermal support can use this driver. 14 If you want this support, you should say Y or M here. 15 16if THERMAL 17 18config THERMAL_HWMON 19 bool 20 prompt "Expose thermal sensors as hwmon device" 21 depends on HWMON=y || HWMON=THERMAL 22 default y 23 help 24 In case a sensor is registered with the thermal 25 framework, this option will also register it 26 as a hwmon. The sensor will then have the common 27 hwmon sysfs interface. 28 29 Say 'Y' here if you want all thermal sensors to 30 have hwmon sysfs interface too. 31 32config THERMAL_OF 33 bool 34 prompt "APIs to parse thermal data out of device tree" 35 depends on OF 36 default y 37 help 38 This options provides helpers to add the support to 39 read and parse thermal data definitions out of the 40 device tree blob. 41 42 Say 'Y' here if you need to build thermal infrastructure 43 based on device tree. 44 45config THERMAL_WRITABLE_TRIPS 46 bool "Enable writable trip points" 47 help 48 This option allows the system integrator to choose whether 49 trip temperatures can be changed from userspace. The 50 writable trips need to be specified when setting up the 51 thermal zone but the choice here takes precedence. 52 53 Say 'Y' here if you would like to allow userspace tools to 54 change trip temperatures. 55 56choice 57 prompt "Default Thermal governor" 58 default THERMAL_DEFAULT_GOV_STEP_WISE 59 help 60 This option sets which thermal governor shall be loaded at 61 startup. If in doubt, select 'step_wise'. 62 63config THERMAL_DEFAULT_GOV_STEP_WISE 64 bool "step_wise" 65 select THERMAL_GOV_STEP_WISE 66 help 67 Use the step_wise governor as default. This throttles the 68 devices one step at a time. 69 70config THERMAL_DEFAULT_GOV_FAIR_SHARE 71 bool "fair_share" 72 select THERMAL_GOV_FAIR_SHARE 73 help 74 Use the fair_share governor as default. This throttles the 75 devices based on their 'contribution' to a zone. The 76 contribution should be provided through platform data. 77 78config THERMAL_DEFAULT_GOV_USER_SPACE 79 bool "user_space" 80 select THERMAL_GOV_USER_SPACE 81 help 82 Select this if you want to let the user space manage the 83 platform thermals. 84 85config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 86 bool "power_allocator" 87 select THERMAL_GOV_POWER_ALLOCATOR 88 help 89 Select this if you want to control temperature based on 90 system and device power allocation. This governor can only 91 operate on cooling devices that implement the power API. 92 93endchoice 94 95config THERMAL_GOV_FAIR_SHARE 96 bool "Fair-share thermal governor" 97 help 98 Enable this to manage platform thermals using fair-share governor. 99 100config THERMAL_GOV_STEP_WISE 101 bool "Step_wise thermal governor" 102 help 103 Enable this to manage platform thermals using a simple linear 104 governor. 105 106config THERMAL_GOV_BANG_BANG 107 bool "Bang Bang thermal governor" 108 default n 109 help 110 Enable this to manage platform thermals using bang bang governor. 111 112 Say 'Y' here if you want to use two point temperature regulation 113 used for fans without throttling. Some fan drivers depend on this 114 governor to be enabled (e.g. acerhdf). 115 116config THERMAL_GOV_USER_SPACE 117 bool "User_space thermal governor" 118 help 119 Enable this to let the user space manage the platform thermals. 120 121config THERMAL_GOV_POWER_ALLOCATOR 122 bool "Power allocator thermal governor" 123 help 124 Enable this to manage platform thermals by dynamically 125 allocating and limiting power to devices. 126 127config CPU_THERMAL 128 bool "generic cpu cooling support" 129 depends on CPU_FREQ 130 depends on THERMAL_OF 131 help 132 This implements the generic cpu cooling mechanism through frequency 133 reduction. An ACPI version of this already exists 134 (drivers/acpi/processor_thermal.c). 135 This will be useful for platforms using the generic thermal interface 136 and not the ACPI interface. 137 138 If you want this support, you should say Y here. 139 140config CLOCK_THERMAL 141 bool "Generic clock cooling support" 142 depends on COMMON_CLK 143 depends on PM_OPP 144 help 145 This entry implements the generic clock cooling mechanism through 146 frequency clipping. Typically used to cool off co-processors. The 147 device that is configured to use this cooling mechanism will be 148 controlled to reduce clock frequency whenever temperature is high. 149 150config DEVFREQ_THERMAL 151 bool "Generic device cooling support" 152 depends on PM_DEVFREQ 153 depends on PM_OPP 154 help 155 This implements the generic devfreq cooling mechanism through 156 frequency reduction for devices using devfreq. 157 158 This will throttle the device by limiting the maximum allowed DVFS 159 frequency corresponding to the cooling level. 160 161 In order to use the power extensions of the cooling device, 162 devfreq should use the simple_ondemand governor. 163 164 If you want this support, you should say Y here. 165 166config THERMAL_EMULATION 167 bool "Thermal emulation mode support" 168 help 169 Enable this option to make a emul_temp sysfs node in thermal zone 170 directory to support temperature emulation. With emulation sysfs node, 171 user can manually input temperature and test the different trip 172 threshold behaviour for simulation purpose. 173 174 WARNING: Be careful while enabling this option on production systems, 175 because userland can easily disable the thermal policy by simply 176 flooding this sysfs node with low temperature values. 177 178config HISI_THERMAL 179 tristate "Hisilicon thermal driver" 180 depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST 181 depends on HAS_IOMEM 182 help 183 Enable this to plug hisilicon's thermal sensor driver into the Linux 184 thermal framework. cpufreq is used as the cooling device to throttle 185 CPUs when the passive trip is crossed. 186 187config IMX_THERMAL 188 tristate "Temperature sensor driver for Freescale i.MX SoCs" 189 depends on CPU_THERMAL 190 depends on MFD_SYSCON 191 depends on OF 192 help 193 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 194 It supports one critical trip point and one passive trip point. The 195 cpufreq is used as the cooling device to throttle CPUs when the 196 passive trip is crossed. 197 198config SPEAR_THERMAL 199 tristate "SPEAr thermal sensor driver" 200 depends on PLAT_SPEAR || COMPILE_TEST 201 depends on HAS_IOMEM 202 depends on OF 203 help 204 Enable this to plug the SPEAr thermal sensor driver into the Linux 205 thermal framework. 206 207config ROCKCHIP_THERMAL 208 tristate "Rockchip thermal driver" 209 depends on ARCH_ROCKCHIP || COMPILE_TEST 210 depends on RESET_CONTROLLER 211 depends on HAS_IOMEM 212 help 213 Rockchip thermal driver provides support for Temperature sensor 214 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 215 trip point. Cpufreq is used as the cooling device and will throttle 216 CPUs when the Temperature crosses the passive trip point. 217 218config RCAR_THERMAL 219 tristate "Renesas R-Car thermal driver" 220 depends on ARCH_RENESAS || COMPILE_TEST 221 depends on HAS_IOMEM 222 help 223 Enable this to plug the R-Car thermal sensor driver into the Linux 224 thermal framework. 225 226config KIRKWOOD_THERMAL 227 tristate "Temperature sensor on Marvell Kirkwood SoCs" 228 depends on MACH_KIRKWOOD || COMPILE_TEST 229 depends on HAS_IOMEM 230 depends on OF 231 help 232 Support for the Kirkwood thermal sensor driver into the Linux thermal 233 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 234 235config DOVE_THERMAL 236 tristate "Temperature sensor on Marvell Dove SoCs" 237 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 238 depends on HAS_IOMEM 239 depends on OF 240 help 241 Support for the Dove thermal sensor driver in the Linux thermal 242 framework. 243 244config DB8500_THERMAL 245 tristate "DB8500 thermal management" 246 depends on MFD_DB8500_PRCMU 247 default y 248 help 249 Adds DB8500 thermal management implementation according to the thermal 250 management framework. A thermal zone with several trip points will be 251 created. Cooling devices can be bound to the trip points to cool this 252 thermal zone if trip points reached. 253 254config ARMADA_THERMAL 255 tristate "Armada 370/XP thermal management" 256 depends on ARCH_MVEBU || COMPILE_TEST 257 depends on HAS_IOMEM 258 depends on OF 259 help 260 Enable this option if you want to have support for thermal management 261 controller present in Armada 370 and Armada XP SoC. 262 263config TEGRA_SOCTHERM 264 tristate "Tegra SOCTHERM thermal management" 265 depends on ARCH_TEGRA 266 help 267 Enable this option for integrated thermal management support on NVIDIA 268 Tegra124 systems-on-chip. The driver supports four thermal zones 269 (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal 270 zones to manage temperatures. This option is also required for the 271 emergency thermal reset (thermtrip) feature to function. 272 273config DB8500_CPUFREQ_COOLING 274 tristate "DB8500 cpufreq cooling" 275 depends on ARCH_U8500 || COMPILE_TEST 276 depends on HAS_IOMEM 277 depends on CPU_THERMAL 278 default y 279 help 280 Adds DB8500 cpufreq cooling devices, and these cooling devices can be 281 bound to thermal zone trip points. When a trip point reached, the 282 bound cpufreq cooling device turns active to set CPU frequency low to 283 cool down the CPU. 284 285config INTEL_POWERCLAMP 286 tristate "Intel PowerClamp idle injection driver" 287 depends on THERMAL 288 depends on X86 289 depends on CPU_SUP_INTEL 290 help 291 Enable this to enable Intel PowerClamp idle injection driver. This 292 enforce idle time which results in more package C-state residency. The 293 user interface is exposed via generic thermal framework. 294 295config X86_PKG_TEMP_THERMAL 296 tristate "X86 package temperature thermal driver" 297 depends on X86_THERMAL_VECTOR 298 select THERMAL_GOV_USER_SPACE 299 select THERMAL_WRITABLE_TRIPS 300 default m 301 help 302 Enable this to register CPU digital sensor for package temperature as 303 thermal zone. Each package will have its own thermal zone. There are 304 two trip points which can be set by user to get notifications via thermal 305 notification methods. 306 307config INTEL_SOC_DTS_IOSF_CORE 308 tristate 309 depends on X86 310 select IOSF_MBI 311 help 312 This is becoming a common feature for Intel SoCs to expose the additional 313 digital temperature sensors (DTSs) using side band interface (IOSF). This 314 implements the common set of helper functions to register, get temperature 315 and get/set thresholds on DTSs. 316 317config INTEL_SOC_DTS_THERMAL 318 tristate "Intel SoCs DTS thermal driver" 319 depends on X86 320 select INTEL_SOC_DTS_IOSF_CORE 321 select THERMAL_WRITABLE_TRIPS 322 help 323 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital 324 temperature sensor (DTS). These SoCs have two additional DTSs in 325 addition to DTSs on CPU cores. Each DTS will be registered as a 326 thermal zone. There are two trip points. One of the trip point can 327 be set by user mode programs to get notifications via Linux thermal 328 notification methods.The other trip is a critical trip point, which 329 was set by the driver based on the TJ MAX temperature. 330 331config INTEL_QUARK_DTS_THERMAL 332 tristate "Intel Quark DTS thermal driver" 333 depends on X86_INTEL_QUARK 334 help 335 Enable this to register Intel Quark SoC (e.g. X1000) platform digital 336 temperature sensor (DTS). For X1000 SoC, it has one on-die DTS. 337 The DTS will be registered as a thermal zone. There are two trip points: 338 hot & critical. The critical trip point default value is set by 339 underlying BIOS/Firmware. 340 341config INT340X_THERMAL 342 tristate "ACPI INT340X thermal drivers" 343 depends on X86 && ACPI 344 select THERMAL_GOV_USER_SPACE 345 select ACPI_THERMAL_REL 346 select ACPI_FAN 347 select INTEL_SOC_DTS_IOSF_CORE 348 select THERMAL_WRITABLE_TRIPS 349 help 350 Newer laptops and tablets that use ACPI may have thermal sensors and 351 other devices with thermal control capabilities outside the core 352 CPU/SOC, for thermal safety reasons. 353 They are exposed for the OS to use via the INT3400 ACPI device object 354 as the master, and INT3401~INT340B ACPI device objects as the slaves. 355 Enable this to expose the temperature information and cooling ability 356 from these objects to userspace via the normal thermal framework. 357 This means that a wide range of applications and GUI widgets can show 358 the information to the user or use this information for making 359 decisions. For example, the Intel Thermal Daemon can use this 360 information to allow the user to select his laptop to run without 361 turning on the fans. 362 363config ACPI_THERMAL_REL 364 tristate 365 depends on ACPI 366 367config INTEL_PCH_THERMAL 368 tristate "Intel PCH Thermal Reporting Driver" 369 depends on X86 && PCI 370 help 371 Enable this to support thermal reporting on certain intel PCHs. 372 Thermal reporting device will provide temperature reading, 373 programmable trip points and other information. 374 375config MTK_THERMAL 376 tristate "Temperature sensor driver for mediatek SoCs" 377 depends on ARCH_MEDIATEK || COMPILE_TEST 378 depends on HAS_IOMEM 379 default y 380 help 381 Enable this option if you want to have support for thermal management 382 controller present in Mediatek SoCs 383 384menu "Texas Instruments thermal drivers" 385depends on ARCH_HAS_BANDGAP || COMPILE_TEST 386depends on HAS_IOMEM 387source "drivers/thermal/ti-soc-thermal/Kconfig" 388endmenu 389 390menu "Samsung thermal drivers" 391depends on ARCH_EXYNOS || COMPILE_TEST 392source "drivers/thermal/samsung/Kconfig" 393endmenu 394 395menu "STMicroelectronics thermal drivers" 396depends on ARCH_STI && OF 397source "drivers/thermal/st/Kconfig" 398endmenu 399 400config QCOM_SPMI_TEMP_ALARM 401 tristate "Qualcomm SPMI PMIC Temperature Alarm" 402 depends on OF && SPMI && IIO 403 select REGMAP_SPMI 404 help 405 This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP) 406 PMIC devices. It shows up in sysfs as a thermal sensor with multiple 407 trip points. The temperature reported by the thermal sensor reflects the 408 real time die temperature if an ADC is present or an estimate of the 409 temperature based upon the over temperature stage value. 410 411endif 412